MBRF2060CTG ON Semiconductor, MBRF2060CTG Datasheet

DIODE SCHOTTKY 60V 10A TO-220FP

MBRF2060CTG

Manufacturer Part Number
MBRF2060CTG
Description
DIODE SCHOTTKY 60V 10A TO-220FP
Manufacturer
ON Semiconductor
Series
SWITCHMODE™r
Datasheet
1.MBRF2060CTG.pdf (4 pages)

Specifications of MBRF2060CTG

Voltage - Forward (vf) (max) @ If
850mV @ 10A
Current - Reverse Leakage @ Vr
150µA @ 60V
Current - Average Rectified (io) (per Diode)
10A
Voltage - Dc Reverse (vr) (max)
60V
Diode Type
Schottky
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Diode Configuration
1 Pair Common Cathode
Mounting Type
Through Hole
Package / Case
TO-220-3 Full Pack (Straight Leads)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Reverse Recovery Time (trr)
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Bonase Electronics (HK) Co., Limited Bonase Electronics (HK) Co., Limited
Part Number:
MBRF2060CTG
Manufacturer:
ON
Quantity:
12 500
Company:
Meier Automation Equipment Co., Limited Meier Automation Equipment Co., Limited
Part Number:
MBRF2060CTG
Manufacturer:
ON/安森美
Quantity:
20 000
Company:
H&T Electronics H&T Electronics
Part Number:
MBRF2060CTG
Quantity:
1 500
MBRF2060CT
SWITCHMODEt
Schottky Power Rectifier
principle in a large area metal−to−silicon power diode.
State−of−the−art geometry features epitaxial construction with oxide
passivation and metal overlay contact. Ideally suited for use as
rectifiers in very low−voltage, high−frequency switching power
supplies, free wheeling diodes and polarity protection diodes.
Features
•
•
•
•
•
•
•
•
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Mechanical Characteristics:
•
•
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•
*For additional information on our Pb−Free strategy and soldering details, please
© Semiconductor Components Industries, LLC, 2009
December, 2009 − Rev. 8
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
The SWITCHMODE Power Rectifier employs the Schottky Barrier
Leads are Readily Solderable
260°C Max. for 10 Seconds
Highly Stable Oxide Passivated Junction
Very Low Forward Voltage Drop
Matched Dual Die Construction
High Junction Temperature Capability
High dv/dt Capability
Excellent Ability to Withstand Reverse Avalanche Energy Transients
Guardring for Stress Protection
Epoxy Meets UL 94 V−0 @ 0.125 in
Electrically Isolated. No Isolation Hardware Required.
Pb−Free Package is Available*
Case: Epoxy, Molded
Weight: 1.9 Grams (Approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Lead Temperature for Soldering Purposes:
1
MBRF2060CT
MBRF2060CTG
Device
1
20 AMPERES, 60 VOLTS
2
SCHOTTKY BARRIER
3
ORDERING INFORMATION
A
Y
WW
B2060 = Device Code
G
AKA
2
MARKING DIAGRAM
http://onsemi.com
RECTIFIER
= Assembly Location
= Year
= Work Week
= Pb−Free Package
= Polarity Designator
TO−220FP
TO−220FP
(Pb−Free)
Package
B2060G
AYWW
A K A
ISOLATED TO−220
Publication Order Number:
CASE 221D
STYLE 3
MBRF2060CT/D
50 Units/Rail
50 Units/Rail
1
3
Shipping

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MBRF2060CTG Summary of contents

Page 1

... AMPERES, 60 VOLTS 2 ISOLATED TO−220 MARKING DIAGRAM AYWW B2060G Assembly Location Y = Year WW = Work Week B2060 = Device Code G = Pb−Free Package AKA = Polarity Designator ORDERING INFORMATION Device Package MBRF2060CT TO−220FP MBRF2060CTG TO−220FP (Pb−Free CASE 221D STYLE 3 Shipping 50 Units/Rail 50 Units/Rail Publication Order Number: MBRF2060CT/D ...

Page 2

MAXIMUM RATINGS (Per Leg) Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (Rated 133° Peak Repetitive Forward Current (Rated V , Square Wave, 20 kHz ...

Page 3

TEST CONDITION FOR ISOLATION TEST* FULLY ISOLATED PACKAGE Figure 3. Mounting Position *Measurement made between leads and heatsink with all leads shorted together. MOUNTING INFORMATION Clip−Mounted Figure 4. Typical Mounting Technique http://onsemi.com 3 LEADS HEATSINK 0.110, MIN CLIP HEATSIN K ...

Page 4

... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...

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