BAS40,215 NXP Semiconductors, BAS40,215 Datasheet - Page 18

• Manufacturer Part Number: BAS40,215
• Description: DIODE SCHOTTKY 40V 120MA SOT-23
• Manufacturer: NXP Semiconductors

Specifications of BAS40,215

• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Voltage - Forward (vf) (max) @ If: 1V @ 40mA
• Voltage - Dc Reverse (vr) (max): 40V
• Current - Average Rectified (io): 120mA (DC)
• Current - Reverse Leakage @ Vr: 10µA @ 40V
• Diode Type: Schottky
• Speed: Small Signal =< 200mA (Io), Any Speed
• Capacitance @ Vr, F: 5pF @ 0V, 1MHz
• Mounting Type: Surface Mount
• Product: Schottky Diodes
• Peak Reverse Voltage: 40 V
• Forward Continuous Current: 0.12 A
• Max Surge Current: 0.2 A
• Configuration: Single
• Forward Voltage Drop: 1 V @ 0.04 A
• Maximum Reverse Leakage Current: 10 uA
• Operating Temperature Range: + 150 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reverse Recovery Time (trr): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4861-2; 934034530215; BAS40 T/R; BAS40 T/R; BAS40,215

NXP Semiconductors
BAS40_1PSXXSB4X_SER_8
Product data sheet
Fig 28. Reflow soldering footprint SOT416
Fig 29. Reflow soldering footprint SOT666
2
1.7
1.075
Reflow soldering is the only recommended soldering method.
0.538
0.55
(2×)
BAS40 series; 1PSxxSB4x series
Dimensions in mm
Rev. 08 — 13 January 2010
0.45
(4×)
(4×)
0.5
2.0
0.85
2.75
2.45
2.1
1.6
1.7
(3x)
0.6
0.6
solder lands
solder resist
3
0.65
(2×)
(2×)
0.7
0.6
2.2
1.9
2
1
1.1
(6×)
0.4
General-purpose Schottky diodes
0.325
0.25
(2×)
(4×)
msa438
(3x)
0.5
solder paste
occupied area
0.375
(2×)
(4×)
0.3
1.5
Dimensions in mm
© NXP B.V. 2010. All rights reserved.
solder lands
placement area
solder paste
occupied area
sot666_fr
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