MBRS360T3G ON Semiconductor, MBRS360T3G Datasheet
MBRS360T3G
Specifications of MBRS360T3G
Available stocks
Related parts for MBRS360T3G
MBRS360T3G Summary of contents
Page 1
... Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device Package Shipping MBRS360T3 SMC 2500/Tape & Reel MBRS360T3G SMC 2500/Tape & Reel (Pb−Free) MBRS360BT3G SMB 2500/Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D ...
Page 2
THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction−to−Lead (Note 2) Thermal Resistance, Junction−to−Ambient (Note 2) Thermal Resistance, Junction−to−Ambient (Note 3) ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (Note 3 25° Maximum Instantaneous Reverse Current (Note ...
Page 3
SQUARE WAVE ...
Page 4
D = 0.5 0.2 10 0.1 0.05 1 0.01 SINGLE PULSE 0.1 0.00001 0.0001 0.001 Figure 8. Thermal Response, Junction−to−Ambient, SMC Package 100 50% Duty Cycle 20% 10 0.1 Single Pulse 0.01 0.000001 0.00001 ...
Page 5
... 3.810 0.150 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SMC PLASTIC PACKAGE CASE 403−03 ISSUE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. ...
Page 6
... Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein ...