CPC1466DTR Clare, CPC1466DTR Datasheet - Page 14
CPC1466DTR
Manufacturer Part Number
CPC1466DTR
Description
DC TERMINATION IC, TAPE/REEL
Manufacturer
Clare
Datasheet
1.CPC1466DTR.pdf
(15 pages)
CPC1466
3.2 Printed Circuit Board Layout Pattern
3.2.1 SOIC
3.3 Tape and Reel Packaging
3.3.1 SOIC
14
Tape and Reel Packaging for 16-Pin SOIC Package
(0.075)
1.90
Embossed
Carrier
(0.024)
0.60
(13.00 Dia)
330.2 Dia
Tape Thickness
(0.004 Max)
0.102 Max
Top Cover
Embossment
(0.366)
9.30
(0.050)
1.27
DIMENSIONS
Top Cover
(inches)
mm
K
K
(0.193 + 0.01)
(0.106 + 0.01)
Tape
0
1
=3.20 + 0.15
=2.70 + 0.15
www.clare.com
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
3.2.2 MLP
NOTE: As the metallic pad on the bottom of the MLP
package is connected to the substrate of the die, Clare
recommends that no printed circuit board traces or
vias be placed under this area.
(0.026)
P=12.00
(0.017)
0.65
(0.47)
0.43
(0.016)
0.40
User Direction of Feed
(0.045)
1.15
(0.045)
1.15
(0.016)
B
0.40
(0.421 + 0.01)
0
(0.031)
=10.70 + 0.15
0.80
A
(0.429 + 0.010)
0
=10.90 + 0.15
W=16.00 + 0.30
(0.630 + 0.010)
DIMENSIONS
Dimensions
(inches)
(inches)
mm
mm
(0.224)
5.70
R00B