SI1024X-T1-E3 Vishay, SI1024X-T1-E3 Datasheet - Page 2

• Manufacturer Part Number: SI1024X-T1-E3
• Description: MOSFET P-CH DUAL 20V SOT563F
• Manufacturer: Vishay
• Series: TrenchFET®r

Specifications of SI1024X-T1-E3

• Transistor Polarity: N-Channel
• Fet Type: 2 N-Channel (Dual)
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 700 mOhm @ 600mA, 4.5V
• Drain To Source Voltage (vdss): 20V
• Current - Continuous Drain (id) @ 25° C: 485mA
• Vgs(th) (max) @ Id: 900mV @ 250µA
• Gate Charge (qg) @ Vgs: 0.75nC @ 4.5V
• Power - Max: 250mW
• Mounting Type: Surface Mount
• Package / Case: SC-89-6, SOT-563F, SOT-666
• Minimum Operating Temperature: - 55 C
• Configuration: Dual
• Resistance Drain-source Rds (on): 0.7 Ohm @ 4.5 V
• Drain-source Breakdown Voltage: 20 V
• Gate-source Breakdown Voltage: +/- 6 V
• Continuous Drain Current: 0.485 A
• Power Dissipation: 280 mW
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Continuous Drain Current Id: 600mA
• Drain Source Voltage Vds: 20V
• On Resistance Rds(on): 1.25ohm
• Rds(on) Test Voltage Vgs: 4.5V
• Threshold Voltage Vgs Typ: 900mV
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: SI1024X-T1-E3TR

Si1024X
Vishay Siliconix
Notes:
a. Pulse test; pulse width  300 µs, duty cycle  2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS (T
www.vishay.com
2
SPECIFICATIONS (T
Parameter
Static
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
Drain-Source On-State
Resistance
Forward Transconductance
Diode Forward Voltage
Dynamic
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Time
Turn-Off Time
b
1.0
0.8
0.6
0.4
0.2
0.0
a
0.0
0.5
a
a
V
DS
Output Characteristics
a
- Drain-to-Source Voltage (V)
1.0
J
= 25 °C, unless otherwise noted)
1.5
Symbol
R
V
I
t
t
I
I
D(on)
DS(on)
V
GS(th)
Q
Q
d(on)
d(off)
GSS
DSS
g
Q
V
SD
gd
fs
gs
g
GS
= 5 V thru 1.8 V
2.0
A
= 25 °C, unless otherwise noted)
I
V
D
DS
V
 200 mA, V
2.5
DS
= 10 V, V
1 V
V
V
V
V
= 20 V, V
V
V
I
V
V
DS
V
GS
GS
GS
S
DS
DS
DS
DD
DS
= 150 mA, V
Test Conditions
3.0
= 4.5 V, I
= 2.5 V, I
= 1.8 V, I
= 0 V, V
= 10 V, I
= V
= 5 V, V
= 20 V, V
= 10 V, R
GS
GEN
GS
GS
= 4.5 V, I
, I
= 0 V, T
GS
D
= 4.5 V, R
D
GS
D
D
D
= 400 mA
= 250 µA
GS
= 600 mA
= 500 mA
= 350 mA
L
GS
= ± 4.5 V
= 4.5 V
= 47 
= 0 V
= 0 V
D
J
= 250 mA
= 85 °C
g
= 10 
1200
1000
800
600
400
200
0
0.0
Min.
0.45
700
0.5
V
Transfer Characteristics
GS
- Gate-to-Source Voltage (V)
± 0.5
1.0
Typ.
0.41
0.53
0.70
750
225
0.3
1.0
0.8
75
10
36
T
25 °C
S10-2432-Rev. D, 25-Oct-10
C
= - 55 °C
Document Number: 71170
1.5
± 1.0
Max.
0.70
0.85
1.25
100
0.9
1.2
5
125 °C
2.0
Unit
mA
µA
nA
µA
pC
ns

V
S
V
2.5