DS3231SN Maxim Integrated Products, DS3231SN Datasheet - Page 2

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DS3231SN

Manufacturer Part Number
DS3231SN
Description
Real Time Clock Extremely Accurate I 2C-Integrated RTC-TC
Manufacturer
Maxim Integrated Products
Datasheet

Specifications of DS3231SN

Function
Clock, Calendar, Battery Backup
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2.3 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Rtc Bus Interface
Serial
Package / Case
SOIC-16
Time Format
HH:MM:SS
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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ABSOLUTE MAXIMUM RATINGS
Voltage Range on V
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Case Thermal Resistance (θ
Operating Temperature Range
Junction Temperature ......................................................+125°C
RECOMMENDED OPERATING CONDITIONS
(T
ELECTRICAL CHARACTERISTICS
(V
3.3V, V
Extremely Accurate I
RTC/TCXO/Crystal
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
Supply Voltage
Logic 1 Input SDA, SCL
Logic 0 Input SDA, SCL
Active Supply Current
Standby Supply Current
Temperature Conversion Current
Power-Fail Voltage
Logic 0 Output, 32kHz,
Logic 0 Output,
Output Leakage Current 32kHz,
Input Leakage SCL
V
(V
A
CC
BAT
INT/SQW Relative to Ground.............................-0.3V to +6.0V
(noncondensing) .............................................-40°C to +85°C
CC
= T
/SQW, SDA
/SQW, SDA
_____________________________________________________________________
= 2.3V to 5.5V, V
Pin I/O Leakage
Active)
Leakage Current
BAT
MIN
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
PARAMETER
to T
= 3.0V, and T
MAX
, unless otherwise noted.) (Notes 2, 3)
CC
, V
CC
A
BAT
= Active Supply (see Table 1), T
= +25°C, unless otherwise noted.) (Notes 2, 3)
, 32kHz, SCL, SDA, RST,
I
SYMBOL
SYMBOL
CCSCONV
I
BATLKG
JC
V
I
I
V
V
V
V
V
CCA
CCS
I
V
I
BAT
I
LO
OL
CC
OL
OL
PF
LI
JA
IH
IL
) (Note 1) ......23°C/W
) (Note 1)....73°C/W
(Notes 4, 5)
I
output on, SQW output off
(Note 5)
I
output on, SQW output off
I
I
Output high impedance
2
2
OL
OL
C bus inactive, 32kHz
C bus inactive, 32kHz
= 3mA
= 1mA
high impedance (Note 6)
2
A
= T
C-Integrated
CONDITIONS
CONDITIONS
MIN
Storage Temperature Range ...............................-40°C to +85°C
Lead Temperature (soldering, 10s) .................................+260°C
Soldering Temperature (reflow, 2 times max)
to T
Lead(Pb)-free...............................................................+260°C
Containing lead(Pb) .....................................................+240°C
(See the Handling, PC Board Layout, and Assembly section.)
MAX
, unless otherwise noted.) (Typical values are at V
V
V
V
V
V
V
CC
CC
CC
CC
CC
CC
= 3.63V
= 5.5V
= 3.63V
= 5.5V
= 3.63V
= 5.5V
0.7 x
MIN
V
2.45
-200
-0.3
MIN
2.3
2.3
-1
-1
CC
2.575
TYP
TYP
3.3
3.0
25
0
V
MAX
MAX
0.3 x
2.70
+10
V
200
300
110
170
575
650
100
5.5
5.5
CC
0.3
0.4
0.4
+1
+1
CC
+
UNITS
UNITS
μA
μA
μA
μA
μA
μA
nA
V
V
V
V
V
V
V
CC
=

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