MC100EL33D ON Semiconductor, MC100EL33D Datasheet
MC100EL33D
Specifications of MC100EL33D
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MC100EL33D Summary of contents
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MC10EL33, MC100EL33 5V ECL ÷4 Divider Description The MC10EL/100EL33 is an integrated ÷4 divider. The differential clock inputs and the V allow a differential, single-ended or AC coupled BB interface to the device. The V pin, an internally generated voltage BB ...
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Table 1. PIN DESCRIPTION Pin CLK, CLK ECL Clock Inputs* Reset ECL Asynch Reset ECL Data Outputs V Reference Voltage Output BB V Positive Supply CC V Negative Supply EE EP (DFN8 only) Thermal exposed pad must be ...
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Table 3. 10EL SERIES PECL DC CHARACTERISTICS Symbol Characteristic I Power Supply Current EE V Output HIGH Voltage (Note Output LOW Voltage (Note Input HIGH Voltage (Single−Ended Input LOW Voltage (Single−Ended) IL ...
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Table 5. 100EL SERIES PECL DC CHARACTERISTICS Symbol Characteristic I Power Supply Current EE V Output HIGH Voltage (Note Output LOW Voltage (Note Input HIGH Voltage (Single−Ended Input LOW Voltage (Single−Ended) IL ...
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Table 7. AC CHARACTERISTICS V CC Symbol Characteristic f Maximum Toggle Frequency max t Propagation Delay PLH t CLK to Q PHL Reset Set/Reset Recovery RR V Input Swing (Note 15 Cycle−to−Cycle Jitter JITTER t ...
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Resource Reference of Application Notes AN1405/D − ECL Clock Distribution Techniques AN1406/D − Designing with PECL (ECL at +5.0 V) AN1503/D − ECLinPSt I/O SPiCE Modeling Kit AN1504/D − Metastability and the ECLinPS Family AN1568/D − Interfacing Between LVDS and ...
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... MC10EL33DTR2 MC10EL33DTR2G MC10EL33MNR4 MC10EL33MNR4G MC100EL33D MC100EL33DG MC100EL33DR2 MC100EL33DR2G MC100EL33DT MC100EL33DTG MC100EL33DTR2 MC100EL33DTR2G MC100EL33MNR4 MC100EL33MNR4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Package SOIC−8 SOIC−8 (Pb− ...
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... G C SEATING PLANE −Z− 0.25 (0.010 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE 0.10 (0.004 SOLDERING FOOTPRINT* 1 ...
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K 8x REF 0.10 (0.004) 0.15 (0.006 L −U− PIN 1 IDENT 0.15 (0.006 −V− C 0.10 (0.004) D −T− G SEATING PLANE PACKAGE DIMENSIONS TSSOP−8 ...
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... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...