DS1646P-120 Maxim Integrated Products, DS1646P-120 Datasheet - Page 11

• Manufacturer Part Number: DS1646P-120
• Description: Real Time Clock
• Manufacturer: Maxim Integrated Products

Specifications of DS1646P-120

• Function: Clock, Calendar, NV Timekeeping RAM
• Rtc Memory Size: 131072 B
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 4.5 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Rtc Bus Interface: Parallel
• Package / Case: PowerCap
• Time Format: HH:MM:SS
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NOTES:
1) All voltages are referenced to ground.
2) Typical values are at 25°C and nominal supplies.
3) Outputs are open.
4) Data retention time is at 25°C and is calculated from the date code on the device package. The date
5) t
6) t
7) Real-Time Clock Modules (EDIP) can be successfully processed through conventional wave-
PACKAGE INFORMATION
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages.
that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a
different suffix character, but the drawing pertains to the package regardless of RoHS status.
PACKAGE TYPE
code XXYY is the year followed by the week of the year in which the device was manufactured. For
example, 9225 would mean the 25th week of 1992.
soldering techniques as long as temperatures as long as temperature exposure to the lithium energy
source contained within does not exceed +85°C. Post-solder cleaning with water washing techniques
is acceptable, provided that ultrasonic vibration is not used.
In addition, for the PowerCap version:
a. Dallas Semiconductor recommends that PowerCap Module bases experience one pass through
b. Hand soldering and touch-up: Do not touch or apply the soldering iron to leads for more than
AH1
AH2
solder reflow oriented with the label side up (“live-bug”).
3 seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove
the part, apply flux, heat the lead frame pad until the solder reflows and use a solder wick to
remove solder.
, t
, t
34 PCAP
32 EDIP
DH1
DH2
are measured from
are measured from
PACKAGE CODE
WE
CE
MDF32+1
PC2+6
going high.
going high.
11 of 12
OUTLINE NO.
21-0245
21-0246
PATTERN NO.
LAND
DS1646/DS1646P
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—
Note