DS34T108GN Maxim Integrated Products, DS34T108GN Datasheet - Page 15

• Manufacturer Part Number: DS34T108GN
• Description: Communication ICs - Various Octal TDM-Over-Packe t Chip AAL1, CESoPSN
• Manufacturer: Maxim Integrated Products

Note 1:
Note 2:
7 Package Information
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages.
DS34T101, DS34T102 and DS34T108 have a 23mm x 23mm 484-lead thermally enhanced ball grid array
(TEBGA) package. The TEBGA package dimensions are shown in Maxim document 21-0365.
DS34T108 has a 23mm x 23mm 484-lead ball grid array with embedded heat sink (HSBGA) package. The HSBGA
package dimensions are shown in Maxim document 21-0366.
8 Thermal Information
Note 1: These numbers are estimates using JEDEC standard PCB and enclosure dimensions.
____________________________________________________ DS34T101, DS34T102, DS34T104, DS34T108
Parameter
Target Ambient Temperature Range
Die Junction Temperature Range
Theta Jc (junction to top of case)
Theta Jb (junction to bottom pins)
Theta Ja, Still Air (Note 1)
Theta Ja, Moving Air (Note 1)
In pin names, the suffix “n” stands for port number: n=1 to 8 for DS34S108; n=1 to 4 for DS34S104; n=2 for DS34S102; n=1 for
DS34S101. All pin names ending in “_N” are active low.
All pins, except power and analog pins, are CMOS/TTL unless otherwise specified in the pin description.
PIN TYPES
I = input pin
I
I
IO = input/output pin
IO
IO
O = output pin
O
P = power-supply or ground pin
PD
PU
Z
PD
PU
= input pin with internal 50k pulldown to DVSS
= input pin with internal 50k pullup to DVDDIO
= output pin that can be placed in a high-impedance state
= input/output pin with internal 50k pulldown to DVSS
= input/output pin with internal 50k pullup to DVDDIO
1m/s
2m/s
-40 to 125C
TEBGA-484
-40 to 85C
DS34T101
DS34T102
DS34T104
16.1 C/W
13.3 C/W
12.5 C/W
4.2 C/W
7.1 C/W
HSBGA-484
-40 to 125C
-40 to 85C
DS34T108
13.0 C/W
10.7 C/W
2.5 C/W
5.5 C/W
9.6 C/W
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