IRLL024NTRPBF International Rectifier, IRLL024NTRPBF Datasheet

MOSFET N-CH 55V 3.1A SOT223

IRLL024NTRPBF

Manufacturer Part Number
IRLL024NTRPBF
Description
MOSFET N-CH 55V 3.1A SOT223
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheets

Specifications of IRLL024NTRPBF

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
65 mOhm @ 3.1A, 10V
Drain To Source Voltage (vdss)
55V
Current - Continuous Drain (id) @ 25° C
3.1A
Vgs(th) (max) @ Id
2V @ 250µA
Gate Charge (qg) @ Vgs
15.6nC @ 5V
Input Capacitance (ciss) @ Vds
510pF @ 25V
Power - Max
1W
Mounting Type
Surface Mount
Package / Case
SOT-223 (3 leads + Tab), SC-73, TO-261
Current, Drain
4.4 A
Gate Charge, Total
10.4 nC
Package Type
SOT-223
Polarization
N-Channel
Power Dissipation
2.1 W
Resistance, Drain To Source On
0.065 Ohm
Temperature, Operating, Maximum
+150 °C
Temperature, Operating, Minimum
-55 °C
Time, Turn-off Delay
18 ns
Time, Turn-on Delay
7.4 ns
Transconductance, Forward
3.3 S
Voltage, Breakdown, Drain To Source
55 V
Voltage, Forward, Diode
1 V
Voltage, Gate To Source
±16 V
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
100 mOhms
Drain-source Breakdown Voltage
55 V
Gate-source Breakdown Voltage
16 V
Continuous Drain Current
4.4 A
Mounting Style
SMD/SMT
Gate Charge Qg
10.4 nC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
IRLL024NPBFTR
IRLL024NTRPBF
IRLL024NTRPBFTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRLL024NTRPBF
Manufacturer:
IR
Quantity:
20 000
Company:
Part Number:
IRLL024NTRPBF
Quantity:
9 000
Company:
Part Number:
IRLL024NTRPBF
Quantity:
20 550
Description
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit,
combined with the fast switching speed and ruggedized
device design that HEXFET Power MOSFETs are well
known for, provides the designer with an extremely efficient
and reliable device for use in a wide variety of applications.
The SOT-223 package is designed for surface-mount
using vapor phase, infra red, or wave soldering techniques.
Its unique package design allows for easy automatic pick-
and-place as with other SOT or SOIC packages but has
the added advantage of improved thermal performance
due to an enlarged tab for heatsinking. Power dissipation
of 1.0W is possible in a typical surface mount application.
l
l
l
l
l
l
l
Absolute Maximum Ratings
Thermal Resistance
* When mounted on FR-4 board using minimum recommended footprint.
** When mounted on 1 inch square copper board, for comparison with other SMD devices.
www.irf.com
I
I
I
I
P
P
V
E
I
E
dv/dt
T
R
R
D
D
D
DM
AR
J,
D
D
GS
AS
AR
θJA
θJA
@ T
@ T
@ T
Surface Mount
Advanced Process Technology
Ultra Low On-Resistance
Dynamic dv/dt Rating
Fast Switching
Fully Avalanche Rated
Lead-Free
@T
@T
T
STG
A
A
A
A
A
= 25°C
= 25°C
= 70°C
= 25°C
= 25°C
Continuous Drain Current, V
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current 
Power Dissipation (PCB Mount)**
Power Dissipation (PCB Mount)*
Linear Derating Factor (PCB Mount)*
Gate-to-Source Voltage
Single Pulse Avalanche Energy‚
Avalanche Current
Repetitive Avalanche Energy*
Peak Diode Recovery dv/dt ƒ
Junction and Storage Temperature Range
Junction-to-Amb. (PCB Mount, steady state)*
Junction-to-Amb. (PCB Mount, steady state)**
Parameter
Parameter
GS
GS
GS
@ 10V**
@ 10V*
@ 10V*
G
Typ.
90
50
IRLL024NPbF
HEXFET
-55 to + 150
D
S
S O T -2 2 3
Max.
± 16
120
4.4
3.1
2.5
2.1
1.0
8.3
5.0
3.1
0.1
12
®
R
Max.
DS(on)
Power MOSFET
120
60
V
I
DSS
D
= 3.1A
= 0.065Ω
= 55V
PD - 95221
Units
mW/°C
Units
°C/W
V/ns
mJ
mJ
°C
W
W
A
V
A
1
04/27/04

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IRLL024NTRPBF Summary of contents

Page 1

... Fully Avalanche Rated Lead-Free l Description Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications ...

Page 2

IRLL024NPbF Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS ∆V Breakdown Voltage Temp. Coefficient /∆T (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward ...

Page 3

VGS TOP 15V 10V 7.0V 5.5V 4.5V 4.0V 3.5V BOTTOM 2.7V 10 2.7V  20µs PULSE WIDTH 0 Drain-to-Source Voltage (V) DS Fig 1. Typical Output Characteristics 100  ...

Page 4

IRLL024NPbF  1000 1MHz iss rss 800 oss 600 C iss 400  C ...

Page 5

T , Case Temperature ( C) C Fig 9. Maximum Drain Current Vs. Case Temperature 1000 100 D = 0.50 0.20 0.10 10 0.05 0.02 0. SINGLE PULSE (THERMAL ...

Page 6

IRLL024NPbF 0.0 1 Ω Fig 12a. Unclamped Inductive Test Circuit Fig 12b. Unclamped Inductive Waveforms Q G 5.0 ...

Page 7

SOT-223 (TO-261AA) Package Outline Dimensions are shown in milimeters (inches) SOT-223 (TO-261AA) Part Marking Information PRODUCT MARKING T HIS IS AN IRF L 014 INT E RNAT IONAL OGO www.irf.com ...

Page 8

IRLL024NPbF SOT-223 (TO-261AA) Tape & Reel Information Dimensions are shown in milimeters (inches (. (. ...

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