B32654A224K EPCOS Inc, B32654A224K Datasheet - Page 34

B32654A224K

Manufacturer Part Number
B32654A224K
Description
Manufacturer
EPCOS Inc
Datasheet

Specifications of B32654A224K

Tolerance (+ Or -)
10%
Voltage
1000VDC/250VAC
Temp Coeff (dielectric)
PLYP
Mounting Style
Through Hole
Construction
Radial
Failure Rate
Not Required
Seated Plane Height
21mm
Product Diameter (mm)
Not Requiredmm
Product Height (mm)
21mm
Product Depth (mm)
11mm
Product Length (mm)
31.5mm
Lead Spacing (nom)
27.5mm
Lead Diameter (nom)
0.8mm
Operating Temp Range
-55C to 100C
Capacitance
.22uF
Package / Case
Not Required
Lead Free Status / RoHS Status
Compliant
3
In many applications, finished circuit assemblies are embedded in plastic resins. In this case,
both chemical and thermal influences of the embedding ("potting") and curing processes must be
taken into account.
Our experience has shown that the following potting materials can be recommended: non-flexible
epoxy resins with acid-anhydride hardeners; chemically inert, non-conducting fillers; maximum
curing temperature of 100 C.
Caution:
Consult us first if you wish to embed uncoated types!
Please read Cautions and warnings and
Important notes at the end of this document.
Embedding of capacitors in finished assemblies
B32651 ... B32656
High pulse (wound)
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