IRLU014 Vishay, IRLU014 Datasheet - Page 2

• Manufacturer Part Number: IRLU014
• Description: MOSFET N-CH 60V 7.7A I-PAK
• Manufacturer: Vishay

Specifications of IRLU014

• Fet Type: MOSFET N-Channel, Metal Oxide
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 200 mOhm @ 4.6A, 5V
• Drain To Source Voltage (vdss): 60V
• Current - Continuous Drain (id) @ 25° C: 7.7A
• Vgs(th) (max) @ Id: 2V @ 250µA
• Gate Charge (qg) @ Vgs: 8.4nC @ 5V
• Input Capacitance (ciss) @ Vds: 400pF @ 25V
• Power - Max: 2.5W
• Mounting Type: Through Hole
• Package / Case: IPak, TO-251, DPak, VPak (3 straight leads + tab)
• Transistor Polarity: N Channel
• Continuous Drain Current Id: 7.7A
• Drain Source Voltage Vds: 60V
• On Resistance Rds(on): 200mohm
• Rds(on) Test Voltage Vgs: 5V
• Threshold Voltage Vgs Typ: 2V
• Configuration: Single
• Resistance Drain-source Rds (on): 0.2 Ohms
• Drain-source Breakdown Voltage: 60 V
• Gate-source Breakdown Voltage: +/- 10 V
• Continuous Drain Current: 7.7 A
• Power Dissipation: 2.5 W
• Maximum Operating Temperature: + 150 C
• Mounting Style: Through Hole
• Minimum Operating Temperature: - 55 C
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant, Contains lead / RoHS non-compliant
• Other names: *IRLU014

IRLR014, IRLU014, SiHLR014, SiHLU014
Vishay Siliconix
Note
a. When mounted on 1" square PCB (FR-4 or G-10 material).
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Pulse width ≤ 300 μs; duty cycle ≤ 2 %.
www.vishay.com
2
Maximum Junction-to-Ambient
Maximum Junction-to-Ambient
(PCB Mount)
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum Junction-to-Case (Drain)
SPECIFICATIONS T
PARAMETER
Static
Drain-Source Breakdown Voltage
V
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
Drain-Source On-State Resistance
Forward Transconductance
Dynamic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Internal Drain Inductance
Internal Source Inductance
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulsed Diode Forward Current
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Forward Turn-On Time
DS
Temperature Coefficient
a
J
= 25 °C, unless otherwise noted
a
SYMBOL
SYMBOL
ΔV
R
V
t
t
C
R
I
I
C
R
R
V
DS(on)
C
Q
Q
V
GS(th)
d(off)
I
GSS
DSS
d(on)
Q
DS
g
Q
L
t
L
SM
t
I
t
t
on
DS
oss
SD
thJA
thJA
thJC
iss
rss
S
gs
gd
rr
fs
r
f
D
S
g
rr
/T
J
Between lead,
6 mm (0.25") from
package and center of
die contact
MOSFET symbol
showing the
integral reverse
p - n junction diode
V
V
V
T
GS
GS
GS
J
V
R
= 25 °C, I
T
Intrinsic turn-on time is negligible (turn-on is dominated by L
DS
g
= 5.0 V
= 4.0 V
= 5.0 V
J
Reference to 25 °C, I
= 12 Ω, R
MIN.
= 25 °C, I
= 48 V, V
V
-
-
-
V
f = 1.0 MHz, see fig. 5
V
V
V
DS
TEST CONDITIONS
GS
DS
DS
DD
c
= V
F
= 0 V, I
V
= 60 V, V
= 25 V, I
= 30 V, I
V
= 10 A, dI/dt = 100 A/μs
V
GS
D
GS
DS
S
GS
GS
= 2.8 Ω, see fig. 10
I
= 7.7 A, V
, I
D
= ± 10 V
= 25 V,
= 0 V, T
= 0 V,
see fig. 6 and 13
D
= 10 A, V
D
= - 250 μA
D
D
= 250 μA
GS
I
I
D
D
= 4.6 A
= 10 A,
= 4.6 A
= 3.9 A
= 0 V
D
TYP.
J
GS
= 1 mA
-
-
-
= 125 °C
DS
G
G
= 0 V
= 48 V,
b
b
b
D
S
b
b
D
S
b
MIN.
1.0
3.4
MAX.
60
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
110
5.0
50
S10-1139-Rev. C, 17-May-10
Document Number: 91321
0.073
TYP.
0.33
400
170
110
9.3
4.5
7.5
42
17
26
65
-
-
-
-
-
-
-
-
-
-
-
-
-
-
MAX.
± 100
0.20
0.28
0.65
250
130
2.0
8.4
3.5
6.0
7.7
1.6
S
25
31
-
-
-
-
-
-
-
-
-
-
-
-
and L
UNIT
°C/W
D
UNIT
V/°C
)
nC
nH
μC
nA
μA
pF
ns
ns
Ω
S
A
V
V
V