IRF6715MTRPBF International Rectifier, IRF6715MTRPBF Datasheet - Page 3

• Manufacturer Part Number: IRF6715MTRPBF
• Description: MOSFET N-CH 25V 34A DIRECTFET
• Manufacturer: International Rectifier
• Series: HEXFET®r

Specifications of IRF6715MTRPBF

• Fet Type: MOSFET N-Channel, Metal Oxide
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 1.6 mOhm @ 34A, 10V
• Drain To Source Voltage (vdss): 25V
• Current - Continuous Drain (id) @ 25° C: 34A
• Vgs(th) (max) @ Id: 2.4V @ 100µA
• Gate Charge (qg) @ Vgs: 59nC @ 4.5V
• Input Capacitance (ciss) @ Vds: 5340pF @ 13V
• Power - Max: 2.8W
• Mounting Type: Surface Mount
• Package / Case: DirectFET™ Isometric MX
• Transistor Polarity: N-Channel
• Resistance Drain-source Rds (on): 2.7 mOhms
• Drain-source Breakdown Voltage: 25 V
• Gate-source Breakdown Voltage: 20 V
• Continuous Drain Current: 180 A
• Power Dissipation: 78 W
• Gate Charge Qg: 40 nC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ˆ
‰
Notes:
ƒ Surface mounted on 1 in. square Cu
P
P
P
T
T
T
R
R
R
R
R
Absolute Maximum Ratings
Thermal Resistance
www.irf.com
D
D
D
P
J
STG
back and with small clip heatsink.
θJA
θJA
θJA
θJC
θJ-PCB
Used double sided cooling , mounting pad with large heatsink.
Mounted on minimum footprint full size board with metalized
(still air).
@T
@T
@T
A
A
C
= 25°C
= 70°C
= 25°C
0.001
0.01
100
0.1
10
1
1E-006
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
D = 0.50
0.20
0.10
0.05
0.02
0.01
Power Dissipation
Power Dissipation
Power Dissipation
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Case
Junction-to-PCB Mounted
Linear Derating Factor
1E-005
0.0001
fl
SINGLE PULSE
( THERMAL RESPONSE )
f
jl
kl
l
Parameter
Parameter
Ã
t 1 , Rectangular Pulse Duration (sec)
0.001
‰
small clip heatsink (still air)
Š
0.01
R
τ
θ
J
τ
is measured at
J
τ
1
Ci= τi/Ri
τ
1
Ci= τi/Ri
R
1
R
1
0.1
with
τ
2
R
τ
2
2
R
2
T
J
of approximately 90°C.
Typ.
12.5
–––
–––
R
1.0
τ
20
3
3
R
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
τ
3
3
τ
A
-40 to + 150
τ
A
1
Ri (°C/W) τi (sec)
footprint full size board with
metalized back and with small
clip heatsink (still air)
Max.
0.022
2.773
24.841
17.387
‰ Mounted on minimum
270
2.8
1.8
78
ƒ
Max.
10
–––
–––
–––
1.6
45
0.053914
8.86912
0.00418
100
Units
Units
°C/W
W/°C
°C
W
3