NTLJS1102PTAG ON Semiconductor, NTLJS1102PTAG Datasheet
NTLJS1102PTAG
Specifications of NTLJS1102PTAG
Related parts for NTLJS1102PTAG
NTLJS1102PTAG Summary of contents
Page 1
NTLJS1102P Power MOSFET −8 V, −8.1 A, mCOOL] Single P−Channel, 2x2 mm, WDFN package Features • WDFN Package with Exposed Drain Pad for Excellent Thermal Conduction • Lowest Package DS(on) • 1 ...
Page 2
THERMAL RESISTANCE RATINGS Parameter Junction−to−Ambient – Steady State (Note 3) Junction−to−Ambient – (Note 3) Junction−to−Ambient – Steady State min Pad (Note 4) 3. Surface−mounted on FR4 board using pad size (Cu area = ...
Page 3
... Pulse Test: pulse width v 300 ms, duty cycle Switching characteristics are independent of operating junction temperatures ORDERING INFORMATION Device NTLJS1102PTBG NTLJS1102PTAG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/ 25°C unless otherwise specified) ...
Page 4
V −2 0.5 1.0 1.5 2.0 2.5 3.0 −V , DRAIN−TO−SOURCE VOLTAGE (V) DS Figure 1. On−Region Characteristics 0.20 0.18 0.16 0.14 0.12 0. −6.2 A ...
Page 5
C iss 2000 1800 1600 1400 1200 C oss 1000 800 600 400 C rss 200 −V , DRAIN−TO−SOURCE VOLTAGE (V) DS Figure 7. Capacitance Variation 1000 V = −4.5 V ...
Page 6
V GS Single Pulse 0.1 0.1 Figure 13. Maximum Rated Forward Biased 1 Duty Cycle = 0.5 0.2 0.1 0.1 0.05 Single Pulse 0.01 1E−04 1E−03 1E−02 TYPICAL CHARACTERISTICS = − 25°C 100 ...
Page 7
... C NOTE 3 0.65 PITCH *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81− ...