NTD5802NT4G ON Semiconductor, NTD5802NT4G Datasheet

MOSFET N-CH 40V 16.4A DPAK

NTD5802NT4G

Manufacturer Part Number
NTD5802NT4G
Description
MOSFET N-CH 40V 16.4A DPAK
Manufacturer
ON Semiconductor
Datasheet

Specifications of NTD5802NT4G

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
4.4 mOhm @ 50A, 10V
Drain To Source Voltage (vdss)
40V
Current - Continuous Drain (id) @ 25° C
16.4A
Vgs(th) (max) @ Id
3.5V @ 250µA
Gate Charge (qg) @ Vgs
100nC @ 10V
Input Capacitance (ciss) @ Vds
5025pF @ 25V
Power - Max
2.5W
Mounting Type
Surface Mount
Package / Case
DPak, TO-252 (2 leads+tab), SC-63
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
6.5 Ohms
Forward Transconductance Gfs (max / Min)
16.8 S
Drain-source Breakdown Voltage
40 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
101 A
Power Dissipation
93.75 W
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Continuous Drain Current Id
101A
Drain Source Voltage Vds
40V
On Resistance Rds(on)
4.4mohm
Rds(on) Test Voltage Vgs
10V
Threshold Voltage Vgs Typ
3.5V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NTD5802NT4G
Manufacturer:
ON
Quantity:
12 500
Part Number:
NTD5802NT4G
Manufacturer:
ON/安森美
Quantity:
20 000
NTD5802N
Power MOSFET
40 V, Single N−Channel, 101 A DPAK
Features
Applications
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
MAXIMUM RATINGS
© Semiconductor Components Industries, LLC, 2011
March, 2011 − Rev. 5
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain Cur-
rent (R
Power Dissipation
(R
Continuous Drain Cur-
rent (R
Power Dissipation
(R
Pulsed Drain Current
Current Limited by Package
Operating Junction and Storage Temperature
Source Current (Body Diode)
Drain to Source dV/dt
Single Pulse Drain−to−Source Avalanche En-
ergy (V
L = 0.3 mH, I
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
Low R
Low Capacitance to Minimize Driver Losses
Optimized Gate Charge to Minimize Switching Losses
MSL 1/260°C
AEC Q101 Qualified
100% Avalanche Tested
These are Pb−Free Devices
CPU Power Delivery
DC−DC Converters
Motor Driver
qJC
qJA
) (Note 1)
) (Note 1)
qJC
qJA
DD
DS(on)
) (Note 1)
) (Note 1)
= 32 V, V
L(pk)
to Minimize Conduction Losses
Parameter
= 40 A, R
GS
= 10 V,
(T
t
J
Steady
p
State
G
=10ms
= 25°C unless otherwise noted)
= 25 W)
T
T
T
T
T
T
T
T
C
C
C
A
A
A
A
A
= 25°C
= 85°C
= 25°C
= 25°C
= 25°C
= 25°C
= 85°C
= 25°C
I
Symbol
DmaxPkg
T
V
dV/dt
V
J
E
I
P
P
, T
T
DSS
DM
I
I
I
GS
D
D
AS
S
D
D
L
stg
−55 to
Value
93.75
"20
16.4
12.7
101
300
175
240
260
2.5
6.0
40
78
45
50
1
Unit
V/ns
mJ
°C
°C
W
W
V
V
A
A
A
A
A
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
V
(BR)DSS
40 V
ORDERING INFORMATION
G
Y
WW
5802N = Device Code
G
MARKING DIAGRAMS
& PIN ASSIGNMENT
http://onsemi.com
7.8 mW @ 5.0 V
4.4 mW @ 10 V
Gate
1 2
CASE 369C
(Bent Lead)
= Year
= Work Week
= Pb−Free Package
1
STYLE 2
R
Drain
Drain 3
D
DPAK
DS(on)
4
2
3
Publication Order Number:
Source
S
4
N−Channel
NTD5802N/D
101 A
50 A
I
D

Related parts for NTD5802NT4G

NTD5802NT4G Summary of contents

Page 1

NTD5802N Power MOSFET 40 V, Single N−Channel, 101 A DPAK Features • Low R to Minimize Conduction Losses DS(on) • Low Capacitance to Minimize Driver Losses • Optimized Gate Charge to Minimize Switching Losses • MSL 1/260°C • AEC Q101 ...

Page 2

THERMAL RESISTANCE MAXIMUM RATINGS Junction−to−Case (Drain) Junction−to−Ambient − Steady State (Note 1) Junction−to−Ambient − Steady State (Note 2) 1. Surface−mounted on FR4 board using pad size Cu. 2. Surface−mounted on FR4 board using the minimum ...

Page 3

ELECTRICAL CHARACTERISTICS Parameter DRAIN−SOURCE DIODE CHARACTERISTICS Forward Diode Voltage Reverse Recovery Time Charge Time Discharge Time Reverse Recovery Charge (T = 25°C unless otherwise noted) J Symbol Test Condition 25° ...

Page 4

TYPICAL PERFORMANCE CHARACTERISTICS 200 180 160 140 T = 25°C J 120 100 DRAIN−TO−SOURCE VOLTAGE (V) DS Figure 1. On−Region Characteristics ...

Page 5

TYPICAL PERFORMANCE CHARACTERISTICS 8000 C iss 7000 6000 5000 4000 3000 2000 C oss 1000 C rss GATE−TO−SOURCE OR DRAIN−TO−SOURCE VOLTAGE (V) Figure 7. Capacitance Variation 1000 V ...

Page 6

... Single Pulse 0.01 0.00001 0.0001 ORDERING INFORMATION Order Number NTD5802NT4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 0.001 0.01 t, PULSE TIME (s) Figure 12. Thermal Response Package DPAK (Pb− ...

Page 7

... M *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein ...

Related keywords