IRFL4105 International Rectifier, IRFL4105 Datasheet

MOSFET N-CH 55V 3.7A SOT223

IRFL4105

Manufacturer Part Number
IRFL4105
Description
MOSFET N-CH 55V 3.7A SOT223
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of IRFL4105

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
45 mOhm @ 3.7A, 10V
Drain To Source Voltage (vdss)
55V
Current - Continuous Drain (id) @ 25° C
3.7A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
35nC @ 10V
Input Capacitance (ciss) @ Vds
660pF @ 25V
Power - Max
1W
Mounting Type
Surface Mount
Package / Case
SOT-223 (3 leads + Tab), SC-73, TO-261
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
*IRFL4105

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Manufacturer
Quantity
Price
Part Number:
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Manufacturer:
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Description
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit,
combined with the fast switching speed and ruggedized
device design that HEXFET Power MOSFETs are well
known for, provides the designer with an extremely efficient
and reliable device for use in a wide variety of applications.
The SOT-223 package is designed for surface-mount
using vapor phase, infra red, or wave soldering techniques.
Its unique package design allows for easy automatic pick-
and-place as with other SOT or SOIC packages but has the
added advantage of improved thermal performance due to
an enlarged tab for heatsinking. Power dissipation of 1.0W
is possible in a typical surface mount application.
Absolute Maximum Ratings
Thermal Resistance
* When mounted on FR-4 board using minimum recommended footprint.
** When mounted on 1 inch square copper board, for comparison with other SMD devices.
www.irf.com
I
I
I
I
P
P
V
E
I
E
dv/dt
T
R
R
D
D
D
DM
AR
J,
D
D
GS
AS
AR
@ T
@ T
@ T
JA
JA
Surface Mount
Advanced Process Technology
Ultra Low On-Resistance
Dynamic dv/dt Rating
Fast Switching
Fully Avalanche Rated
@T
@T
T
STG
A
A
A
A
A
= 25°C
= 25°C
= 70°C
= 25°C
= 25°C
Continuous Drain Current, V
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Power Dissipation (PCB Mount)**
Power Dissipation (PCB Mount)*
Linear Derating Factor (PCB Mount)*
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Junction and Storage Temperature Range
Junction-to-Amb. (PCB Mount, steady state)*
Junction-to-Amb. (PCB Mount, steady state)**
Parameter
Parameter
GS
GS
GS
@ 10V**
@ 10V*
@ 10V*
G
Typ.
90
50
S
D
HEXFET
-55 to + 150
S O T -22 3
Max.
0.10
± 20
110
5.2
3.7
3.0
1.0
8.3
5.0
2.1
3.7
30
IRFL4105
R
®
DS(on)
Max.
Power MOSFET
V
120
60
I
DSS
D
= 3.7A
= 0.045
= 55V
PD- 91381A
mW/°C
Units
Units
°C/W
V/ns
mJ
mJ
°C
W
W
A
V
A
1
1/14/99

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IRFL4105 Summary of contents

Page 1

... When mounted on FR-4 board using minimum recommended footprint. ** When mounted on 1 inch square copper board, for comparison with other SMD devices. www.irf.com HEXFET 10V 10V 10V 150 Typ PD- 91381A IRFL4105 ® Power MOSFET V = 55V DSS R = 0.045 DS(on 3. -22 3 Max. Units 5.2 3 ...

Page 2

... IRFL4105 Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward Leakage I GSS Gate-to-Source Reverse Leakage Q Total Gate Charge g Q Gate-to-Source Charge ...

Page 3

... G ate-to -So urce Voltag e ( Fig 3. Typical Transfer Characteristics www.irf.com TOP BOTTOM 4. 0 Fig 2. Typical Output Characteristics °C J 1.0 0 0.0 A 6.0 6.5 7.0 -60 Fig 4. Normalized On-Resistance IRFL4105 VGS 15V 10V 8.0V 7.0V 6.0V 5.5V 5.0V 4 .5V 20 µ ° rain-to-S ource V oltage ( 150 3 -40 - ...

Page 4

... IRFL4105 iss oss rss rain-to-S ourc e V oltage ( Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage ° ° 0.4 0.6 0.8 1 ourc e-to-D rain V oltage ( Fig 7. Typical Source-Drain Diode Forward Voltage Fig 6. Typical Gate Charge Vs ing lse 0.1 1.2 1.4 1.6 0.1 Fig 8. Maximum Safe Operating Area = 3 ...

Page 5

... Current Sampling Resistors Fig 9b. Gate Charge Test Circuit 0 Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient www.irf.com 10V Pulse Width Duty Factor Fig 10a. Switching Time Test Circuit d(on) Fig 10b. Switching Time Waveforms 0 lse tio n ( IRFL4105 D.U. µ d(off ...

Page 6

... IRFL4105 . Fig 12a. Unclamped Inductive Test Circuit Fig 12b. Unclamped Inductive Waveforms RIV tarting unc tion T em perature (°C ) Fig 12c. Maximum Avalanche Energy . TTO M 3 Vs. Drain Current www.irf.com ...

Page 7

... Driver same type as D.U.T. I controlled by Duty Factor "D" SD D.U.T. - Device Under Test Period D = P.W. Waveform SD Body Diode Forward Current di/dt Waveform DS Diode Recovery dv/dt Body Diode Forward Drop Ripple for Logic Level Devices Fig 13. For N-Channel HEXFETS IRFL4105 + + P.W. Period V =10V * ...

Page 8

... IRFL4105 Package Outline SOT-223 (TO-261AA) Outline Part Marking Information SOT-223 TIO www.irf.com ...

Page 9

... IR TAIWAN:16 Fl. Suite D. 207, Sec. 2, Tun Haw South Road, Taipei, 10673, Taiwan Tel: 886-2-2377-9936 http://www.irf.com/ www.irf.com (. (. (. (. (. (. (. (. (. (. .40 (. . CANADA: 15 Lincoln Court, Brampton, Ontario L6T3Z2, Tel: (905) 453 2200 IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel 451 0111 Data and specifications subject to change without notice. 1/99 IRFL4105 (. (. (. (. (. (. (. (. 0. (. ...

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