LM4861MX/NOPB National Semiconductor, LM4861MX/NOPB Datasheet - Page 10

• Manufacturer Part Number: LM4861MX/NOPB
• Description: Audio Amp Speaker 1-CH Mono 1.1W Class-AB 8-Pin SOIC N T/R
• Manufacturer: National Semiconductor

Specifications of LM4861MX/NOPB

• Package: 8SOIC N
• Function: Speaker
• Amplifier Type: Class-AB
• Total Harmonic Distortion Noise: 0.72@8Ohm@1W %
• Typical Psrr: 65 dB
• Output Signal Type: Differential
• Maximum Load Resistance: 8 Ohm
• Output Type: 1-Channel Mono
• Amplifier Class: AB
• No. Of Channels: 1
• Output Power: 1.1W
• Supply Voltage Range: 2V To 5.5V
• Load Impedance: 8ohm
• Operating Temperature Range: -40°C To +85°C
• Amplifier Case Style: SOIC
• Rohs Compliant: Yes

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LM4861 MDA MWA
1.1W Audio Power Amplifier with Shutdown Mode
DIE/WAFER CHARACTERISTICS
SIGNAL NAME
SHUTDOWN
BYPASS
NC
NC
INPUT +
INPUT -
GND
Vo1
GND
VDD
NC
GND
Vo2
GND
Physical Die Identification
Die Step
Wafer Diameter
Dise Size (Drawn)
Thickness
Min Pitch
Special Assembly Requirements:
Note: Actual die size is rounded to the nearest micron.
PAD# NUMBER
(Referenced to die center, coordinates in µm) NC = No Connection, N.U. = Not Used
Fabrication Attributes
Physical Attributes
10
11
12
13
14
1
2
3
4
5
6
7
8
9
Die Bond Pad Coordinate Locations (B - Step)
-425
-445
-445
-445
-445
-352
-243
-215
445
445
445
445
-91
-63
X/Y COORDINATES
X
LM4861B
B
150mm
1372µm x 2032µm
54.0mils x 80.0mils
406µm Nominal
108µm Nominal
Die Layout (B - Step)
10
-383
-492
-710
-710
-710
-574
710
499
387
633
710
710
-34
-2
Y
Bond Pad Opening Size (min)
Bond Pad Metalization
Passivation
Back Side Metal
Back Side Connection
01198626
170
170
83
83
83
83
83
83
83
83
83
83
83
83
X
General Die Information
PAD SIZE
x
x
x
x
x
x
x
x
x
x
x
x
x
x
83µm x 83µm
ALUMINUM
VOM NITRIDE
BARE BACK
GND
170
170
170
170
83
83
83
83
83
83
83
83
83
83
Y