CE TMK316 BJ475KL-T Taiyo Yuden, CE TMK316 BJ475KL-T Datasheet - Page 24

• Manufacturer Part Number: CE TMK316 BJ475KL-T
• Description: Cap Ceramic 4.7uF 25VDC X5R 10% SMD 1206 T/R
• Manufacturer: Taiyo Yuden
• Type: Flatr

Specifications of CE TMK316 BJ475KL-T

• Package/case: 1206
• Mounting: Surface Mount
• Capacitance Value: 4.7 uF
• Dielectric: X5R
• Voltage: 25 Vdc
• Product Length: 3.2 mm
• Product Height: 1.6 mm
• Tolerance: 10 %

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【Test Methods and Remarks】
【Test Methods and Remarks】
【Test Methods and Remarks】
【Test Methods and Remarks】
【Test Methods and Remarks】
【Test Methods and Remarks】
【Test Methods and Remarks】
【Test Methods and Remarks】
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Super Low Distortion Multilayer Ceramic Capacitors （CFCAP）
５． Insulation Resistance
７． Dissipation Factor
＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
1. Operating Temperature Range
Specified Value
2. Storage Temperature Range
Specified Value
3. Rated Voltage
Specified Value
4. Dielectric Withstanding Voltage （ Between terminals）
Specified Value
Specified Value
6． Capacitance （Tolerance）
Specified Value
Specified Value
8． Bending Strength
Specified Value
9． Adhesive Force of Terminal Electrodes
Specified Value
10． Solderability
Specified Value
11． Resistance to Soldering Heat
Specified Value
Applied voltage: Rated voltage×3
Duration: 1 to 5 sec.
Charge/discharge current: 50mA max.
Applied voltage: Rated voltage
Duration: 60±5 sec.
Charge/discharge current: 50mA max.
Measuring frequency：1 ｋ Hz±10%
Measuring voltage：1±0.2Vrms
Bias application: None
Measuring frequency：1 ｋ Hz±10%
Measuring voltage：1±0.2Vrms
Bias application: None
Warp: 1mm
Speed: 0.5mm/second
Duration:10 seconds
Test board: glass epoxy resin substrate
Thickness: 1.6mm
Capacitance measurement shall be conducted with the board bent.
Applied force: 5N
Duration: 30 ±5 seconds
Solder temp.: 270 ±5℃
Duration: 3 ±0.5 sec.
Preheating conditions： 80 to 100℃, 2 to 5 min. or 5 to 10 min.
Measurement shall be conducted : 24±2hrs under the standard condition
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
RELIABILITY DATA
Lead-free solder
Eutectic solder
Snー3.0Agー0.5Cu
150 to 200℃, 2 to 5 min. or 5 to 10 min.
H60A or H63A
Solder type
Solder temperature
230±5℃
245±3℃
－55 to ＋125℃
－55 to ＋125℃
±10％
6.3VDC, 10VDC, 16VDC, 25VDC, 35VDC, 50VDC
No breakdown or damage
10000 MΩ or 500MΩμF, whichever is smaller
0.1%max
Appearance: No abnormality
Capacitance change: ±5%
Terminal electrodes shall be no exfoliation or a sign of exfoliation.
At least 95% of terminal electrode is covered by new solder.
Appearance: No abnormality
Capacitance change: ±2.5% max.
Dissipation factor : Initial value
Insulation resistance: Initial value
Withstanding voltage （between terminals） : No abnormality
4±1 sec.
Duration
Note1
R-230
Multilayer Ceramic Capacitors and Medium-High Voltage Multilayer Ceramic
Capacitors are noted separately.
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