HSMP-3814-TR1G Avago Technologies US Inc., HSMP-3814-TR1G Datasheet - Page 4
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HSMP-3814-TR1G
Manufacturer Part Number
HSMP-3814-TR1G
Description
DIODE PIN ATTENUATOR 100V SOT-23
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HSMP-3812-BLKG.pdf
(9 pages)
Specifications of HSMP-3814-TR1G
Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Diode Type
PIN - 1 Pair Common Cathode
Voltage - Peak Reverse (max)
100V
Current - Max
1A
Capacitance @ Vr, F
0.35pF @ 50V, 1MHz
Resistance @ If, F
3 Ohm @ 100mA, 100MHz
Configuration
Dual Common Cathode
Reverse Voltage
100 V
Forward Continuous Current
1 A
Termination Style
SMD/SMT
Carrier Life
1.5 us
Maximum Diode Capacitance
0.35 pF @ 50 V
Maximum Operating Temperature
+ 150 C
Maximum Series Resistance @ Maximum If
3 Ohm @ 100 mA
Maximum Series Resistance @ Minimum If
53 Ohm (Typ) @ 1 mA
Minimum Operating Temperature
- 65 C
Mounting Style
SMD/SMT
Recovery Time
300 nS
Diode Case Style
SOT-23
Breakdown Voltage
100V
Capacitance Ct
0.27pF
Leaded Process Compatible
Yes
Peak Reflow Compatible (260 C)
Yes
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power Dissipation (max)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
516-1800-2
HSMP-3814-TR1G
HSMP-3814-TR1G
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HSMP-3814-TR1G
Manufacturer:
AGILENT
Quantity:
510
Part Number:
HSMP-3814-TR1G
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Typical Applications for HSMP-481x Low Inductance Series
Microstrip Series Connection for HSMP-481x Series
In order to take full advantage of the low inductance of the
HSMP-481x series when using them in series applications,
both lead 1 and lead 2 should be connected together, as
shown in Figure 7.
Figure 6. Internal Connections.
Microstrip Shunt Connections for HSMP-481x Series
In Figure 8, the center conductor of the microstrip
line is interrupted and leads 1 and 2 of the HSMP-481x
series diode are placed across the resulting gap. This forces
the 1.5 nH lead inductance of leads 1 and 2 to appear as
part of a low pass filter, reducing the shunt
parasitic inductance and increasing the maximum available
attenuation. The 0.3 nHof shunt inductance external to the
diode is created by the via holes, and is a good estimate
for 0.032" thick material.
Figure 8. Circuit Layout.
4
50 OHM MICROSTRIP LINES
1
HSMP-481x
PAD CONNECTED TO
3
GROUND BY TWO
VIA HOLES
2
Figure 7. Circuit Layout.
Figure 9. Equivalent Circuit.
R
j
1.5 nH
0.08
I
b
0.9
R
+ 2.5
j
0.3 nH
0.3 nH
0.3 pF
1.5 nH