B32923C3154K EPCOS (TDK), B32923C3154K Datasheet - Page 12
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B32923C3154K
Manufacturer Part Number
B32923C3154K
Description
Manufacturer
EPCOS (TDK)
Datasheet
1.B32922C3473M.pdf
(18 pages)
Specifications of B32923C3154K
Mounting
Through Hole
Capacitance Value
0.15 uF
Voltage
305 Vac
Dielectric
PP
Lead Pitch For Radial
22.5 mm
Tolerance
10 %
Operating Temperature
-40 to 105 °C
3
In many applications, finished circuit assemblies are embedded in plastic resins. In this case,
both chemical and thermal influences of the embedding ("potting") and curing processes must be
taken into account.
Our experience has shown that the following potting materials can be recommended: non-flexible
epoxy resins with acid-anhydride hardeners; chemically inert, non-conducting fillers; maximum
curing temperature of 100 C.
Caution:
Consult us first if you wish to embed uncoated types!
Please read Cautions and warnings and
Important notes at the end of this document.
Embedding of capacitors in finished assemblies
B32921C/D ... B32926C/D
X2 / 305 V AC
Page 12 of 18