HSMP-386F-BLKG Avago Technologies US Inc., HSMP-386F-BLKG Datasheet - Page 6

• Manufacturer Part Number: HSMP-386F-BLKG
• Description: DIODE PIN GP 50V LO COST SOT-323
• Manufacturer: Avago Technologies US Inc.

Specifications of HSMP-386F-BLKG

• Diode Type: PIN - 1 Pair Common Cathode
• Voltage - Peak Reverse (max): 50V
• Current - Max: 1A
• Capacitance @ Vr, F: 0.2pF @ 50V, 1MHz
• Resistance @ If, F: 1.5 Ohm @ 100mA, 100MHz
• Package / Case: SC-70-3, SOT-323-3
• Capacitance Cd Max @ Vr F: 0.2pF
• Resistance @ If: 3ohm
• Repetitive Reverse Voltage Vrrm Max: 50V
• Forward Current If(av): 1A
• Diode Case Style: SOT-323
• No. Of Pins: 3
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation (max): -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Ordering Information
Specify part number followed by option. For example:
Option Descriptions
-BLKG = Bulk, 100 pcs. per antistatic bag
-TR1G = Tape and Reel, 3000 devices per 7" reel
-TR2G = Tape and Reel, 10,000 devices per 13" reel
Tape and Reeling conforms to Electronic Industries RS-481,
“Taping of Surface Mounted Components for Automated Placement. ”
Assembly Information
SOT-323 PCB Footprint
Recommended PCB pad layouts for the miniature SOT
packages are shown in Figures 15, 16, 17. These layouts
provide ample allowance for package placement by
automated assembly equipment without adding parasitics
that could impair the performance.
Figure 15. Recommended PCB Pad Layout for Avago’s SC70 3L/SOT-323
Products.
6
HSMP - 386x - XXX
0.039
0.026
Dimensions in inches
0.022
0.079
Bulk or Tape and Reel Option
Part Number; x = Lead Code
Surface Mount PIN
Figure 16. Recommended PCB Pad Layout for Avago’s SC70 6L/SOT-363 Prod-
ucts.
Figure 17. Recommended PCB Pad Layout for Avago’s SOT-23 Products.
0.039
0.035
0.039
1
0.9
0.026
Dimensions in inches
0.018
Dimensions in inches
0.031
0.8
0.039
0.079
mm
1
0.079
2.0