HSMP-389F-TR1G Avago Technologies US Inc., HSMP-389F-TR1G Datasheet - Page 7
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HSMP-389F-TR1G
Manufacturer Part Number
HSMP-389F-TR1G
Description
DIODE PIN SWITCH 100V SOT-323
Manufacturer
Avago Technologies US Inc.
Type
Switchr
Datasheet
1.HSMP-3890-BLKG.pdf
(13 pages)
Specifications of HSMP-389F-TR1G
Diode Type
PIN - 1 Pair Common Cathode
Voltage - Peak Reverse (max)
100V
Current - Max
1A
Capacitance @ Vr, F
0.3pF @ 5V, 1MHz
Resistance @ If, F
2.5 Ohm @ 5mA, 100MHz
Package / Case
SC-70-3, SOT-323-3
Diode Case Style
SC-70
Series Resistance @ If
2.5ohm
Peak Reflow Compatible (260 C)
Yes
Capacitance Ct
0.2pF
Reel Quantity
3000
Pin Configuration
Common Cathode
Configuration
Dual Common Cathode
Operating Temperature Classification
Military
Reverse Voltage
100V
Mounting
Surface Mount
Operating Temperature (max)
150C
Operating Temperature (min)
-65C
Pin Count
3
Applications Frequency Range
VHF/UHF/SHF
Breakdown Voltage
100V
Capacitance
0.2pF
Leaded Process Compatible
Yes
Mounting Type
Surface Mount
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power Dissipation (max)
-
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HSMP-389F-TR1G
Manufacturer:
AVAGO
Quantity:
73 000
Typical Applications for HSMP-489x Low Inductance Series
Microstrip Series Connection for HSMP-489x Series
In order to take full advantage of the low inductance
of the HSMP-489x series when using them in series ap-
plications, both lead 1 and lead 2 should be connected
together, as shown in Figure 17.
Figure 16. Internal Connections.
Figure 16. Internal Connections.
Figure 17. Circuit Layout.
Microstrip Shunt Connections for HSMP-489x Series
In Figure 18, the center conductor of the microstrip line
is interrupted and leads 1 and 2 of the HSMP-489x diode
are placed across the resulting gap. This forces the 1.5
nH lead inductance of leads 1 and 2 to appear as part of
a low pass filter, reducing the shunt parasitic inductance
and increasing the maximum available attenuation. The
0.3 nH of shunt inductance external to the diode is cre-
ated by the via holes, and is a good estimate for 0.032"
thick material.
Figure 18. Circuit Layout.
Figure 18. Circuit Layout.
Figure 19. Equivalent Circuit.
7
Figure 19. Equivalent Circuit.
50 OHM MICROSTRIP LINES
Figure 17. Circuit Layout.
1.5 nH
1
HSMP-489x
PAD CONNECTED TO
GROUND BY TWO
3
VIA HOLES
0.3 nH
0.3 nH
2
0.3 pF
1.5 nH
R
C
R
Equivalent Circuit Model
HSMP-389x Chip*
Co-Planar Waveguide Shunt Connection for HSMP-489x Series
Co-Planar waveguide, with ground on the top side of
the printed circuit board, is shown in Figure 20. Since
it eliminates the need for via holes to ground, it offers
lower shunt parasitic inductance and higher maximum
attenuation when compared to a microstrip circuit.
A SPICE model is not available for PIN diodes as SPICE
does not provide for a key PIN diode characteristic, car-
rier lifetime.
I = Forward Bias Current in mA
* See AN1124 for package models
Figure 20. Circuit Layout.
Figure 21. Equivalent Circuit.
T
T
j
=
0.5 Ω
= 0.5 + R
= C
R
Figure 20. Circuit Layout.
Figure 21. Equivalent Circuit.
s
20
I
P
0.9
+ C
Ω
j
* Measured at -20 V
j
0.12 pF*
R
C
j
0.75 nH
j
0.3 pF
Co-Planar Waveguide
Groundplane
Center Conductor
Groundplane