LE75282BBVC Zarlink, LE75282BBVC Datasheet - Page 7
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LE75282BBVC
Manufacturer Part Number
LE75282BBVC
Description
SLIC 2-CH 5V 32-Pin PLCC
Manufacturer
Zarlink
Datasheet
1.LE75282BBVC.pdf
(19 pages)
Specifications of LE75282BBVC
Package
32PLCC
Number Of Channels Per Chip
2
Minimum Operating Supply Voltage
4.75 V
Typical Operating Supply Voltage
5 V
Typical Supply Current
4(Max) mA
Available stocks
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Part Number
Manufacturer
Quantity
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Company:
Part Number:
LE75282BBVC
Manufacturer:
ZARLINK
Quantity:
9
OPERATING RANGES
The operating ranges define those limits between which the functionality of the device is guaranteed.
Commercial (C) Devices
Ambient temperature .............................0°C to +70°C*
V
V
AGND/DGND ..........................................................0 V
BGND with respect to
Load resistance on VTX to ground .............. 20 kΩ min
* Zarlink guarantees the performance of this device over commercial (0 to 70º C) and industrial (-40 to 85ºC) temperature ranges
by conducting electrical characterization over each range and by conducting a production test with single insertion coupled to
periodic sampling. These characterization and test procedures comply with section 4.6.2 of Bellcore GR-357-CORE Component
Reliability Assurance Requirements for Telecommunications Equipment.
Package Assembly
The standard (non-green) package devices are assembled with industry-standard mold compounds, and the leads possess a tin/
lead (Sn/Pb) plating. These packages are compatible with conventional SnPb eutectic solder board assembly processes. The
peak soldering temperature should not exceed 225°C during printed circuit board assembly.
The green package devices are assembled with enhanced environmental compatible lead (Pb), halogen, and antimony-free
materials. The leads possess a matte-tin plating which is compatible with conventional board assembly processes or newer lead-
free board assembly processes. The peak soldering temperature should not exceed 245°C during printed circuit board assembly.
Refer to IPC/JEDEC J-Std-020B Table 5-2 for the recommended solder reflow temperature profile
CC
BAT
AGND/DGND ....................... –100 mV to +100 mV
..................................................... 4.75 V to 5.25 V
..................................................... –19 V to –58 V
Zarlink Semiconductor Inc.
7