HSMS-280F-TR1G Avago Technologies US Inc., HSMS-280F-TR1G Datasheet - Page 6

• Manufacturer Part Number: HSMS-280F-TR1G
• Description: DIODE SCHOTTKY RF CC 70V SOT-23
• Manufacturer: Avago Technologies US Inc.

Specifications of HSMS-280F-TR1G

• Diode Type: Schottky - 1 Pair Common Cathode
• Voltage - Peak Reverse (max): 70V
• Current - Max: 1A
• Capacitance @ Vr, F: 2pF @ 0V, 1MHz
• Resistance @ If, F: 35 Ohm @ 5mA, 1MHz
• Package / Case: SC-70-3, SOT-323-3
• Diode Case Style: SOT-323
• No. Of Pins: 3
• Peak Reflow Compatible (260 C): Yes
• Leaded Process Compatible: Yes
• Forward Voltage: 410mV
• Repetitive Reverse Voltage Vrrm Max: 70V
• Forward Current If: 1A
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation (max): -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

SMT Assembly
Reliable assembly of surface mount components is a
complex process that involves many material, process, and
equipment factors, including: method of heating (e.g., IR
or vapor phase reflow, wave soldering, etc.) circuit board
material, conductor thickness and pattern, type of solder
alloy, and the thermal conductivity and thermal mass of
components. Components with a low mass, such as the
SOT package, will reach solder reflow temperatures faster
than those with a greater mass.
Avago’s SOT diodes have been qualified to the time-
temperature profile shown in Figure 8. This profile is
representative of an IR reflow type of surface mount as-
sembly process.
After ramping up from room temperature, the circuit
board with components attached to it (held in place
with solder paste) passes through one or more preheat
Figure 8. Surface Mount Assembly Profile.
Lead-Free Reflow Profile Recommendation (IPC/JEDEC J-STD-020C)
Note 1: All temperatures refer to topside of the package, measured on the package body surface
6
Reflow Parameter
Average ramp-up rate (Liquidus Temperature (T
Preheat
Ts(max) to TL Ramp-up Rate
Time maintained above:
Peak Temperature (T
Time within 5 °C of actual Peak temperature (t
Ramp-down Rate
Time 25 °C to Peak Temperature
Tp
T
25
L
Ts
Ts
min
max
P
)
t 25
Preheat
°
ts
C to Peak
P
)
Ramp-up
S(max)
Time
to Peak)
Temperature Min (T
Temperature Max (T
Time (min to max) (t
Temperature (T
Time (t
Ramp-down
tp
zones. The preheat zones increase the temperature of the
board and components to prevent thermal shock and
begin evaporating solvents from the solder paste. The
reflow zone briefly elevates the temperature sufficiently
to produce a reflow of the solder.
The rates of change of temperature for the ramp-up and
cool-down zones are chosen to be low enough to not
cause deformation of the board or damage to compo-
nents due to thermal shock. The maximum temperature
in the reflow zone (T
These parameters are typical for a surface mount assem-
bly process for Avago diodes. As a general guideline, the
circuit board and components should be exposed only
to the minimum temperatures and times necessary to
achieve a uniform reflow of solder.
L
t
)
L
L
)
S(min)
S(max)
S
)
Critical Zone
T
L
to Tp
)
)
MAX
) should not exceed 260°C.
Lead-Free Assembly
3°C/ second max
150°C
200°C
60-180 seconds
3°C/second max
217°C
60-150 seconds
260 +0/-5°C
20-40 seconds
6°C/second max
8 minutes max