HSMP-3833-BLKG Avago Technologies US Inc., HSMP-3833-BLKG Datasheet - Page 6

• Manufacturer Part Number: HSMP-3833-BLKG
• Description: DIODE PIN GP 200V SOT-23
• Manufacturer: Avago Technologies US Inc.
• Type: Attenuator/Switchr

Specifications of HSMP-3833-BLKG

• Diode Type: PIN - 1 Pair Common Anode
• Voltage - Peak Reverse (max): 200V
• Current - Max: 1A
• Capacitance @ Vr, F: 0.3pF @ 50V, 1MHz
• Resistance @ If, F: 1.5 Ohm @ 100mA, 100MHz
• Power Dissipation (max): 250mW
• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Capacitance Cd Max @ Vr F: 0.3pF
• Resistance @ If: 1.5ohm
• Center Frequency: 100MHz
• Repetitive Reverse Voltage Vrrm Max: 200V
• Forward Current If(av): 100mA
• Diode Case Style: SOT-23
• Configuration: Dual Common Anode
• Power Dissipation: 250mW
• Operating Temperature Classification: Military
• Package Type: SOT-23
• Mounting: Surface Mount
• Maximum Series Resistance @ Maximum If: 1.5@100mAOhm
• Operating Temperature (max): 150C
• Operating Temperature (min): -65C
• Pin Count: 3
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Package Dimensions
Outline 23 (SOT-23)
Package Characteristics
Lead Material .............................................................................................................................Alloy 42
Lead Finish ..........................................................................................Tin 100% (Lead-free option)
Maximum Soldering Temperature ............................................................. 260°C for 5 seconds
Minimum Lead Strength . ........................................................................................... 2 pounds pull
Typical Package Inductance ....................................................................................................... 2 nH
Typical Package Capacitance ...............................................................0.08 pF (opposite leads)
Profile Option Descriptions
-BLKG = Bulk
-TR1G = 3K pc. Tape and Reel, Device Orientation; See Figure 13
-TR2G = 10K pc. Tape and Reel, Device Orientation; See Figure 13
Tape and Reeling conforms to Electronic Industries RS-481, “Taping of Surface
Mounted Components for Automated Placement. ”
Ordering Information
Specify part number followed by option. For example:
HSMP - 383x - XXX
6
E
A1
Notes:
XXX-package marking
Drawings are not to scale
e2
e
XXX
e1
D
B
E1
A
Bulk or Tape and Reel Option
Part Number
Surface Mount PIN Diode
SYMBOL
A1
E1
e1
e2
B
D
A
C
e
E
L
0.000
DIMENSIONS (mm)
MIN.
0.79
0.30
0.08
2.73
1.15
0.89
1.78
0.45
2.10
0.45
C
0.100
MAX.
1.20
0.54
0.20
3.13
1.50
1.02
2.04
0.60
2.70
0.69
L
Recommended PCB Pad Layout
for Avago’s SOT-23 Products
0.039
0.035
1
0.9
Dimensions in inches
0.031
0.8
0.039
mm
1
0.079
2.0