HSMP-386J-TR1G Avago Technologies US Inc., HSMP-386J-TR1G Datasheet
HSMP-386J-TR1G
Specifications of HSMP-386J-TR1G
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HSMP-386J-TR1G Summary of contents
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... Transmit/Receive switching application housed in QFN 2x2mm size package which is having good thermal resistance. The unique with 8 dies in parallel configuration results to low IL performance and low series resistance. The HSMP- 386J Power diode is built with match diode to ensure con- sistency in performance. Package Marking & Orientation ...
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Table 1. Absolute Maximum Ratings Symbol Parameter I Forward Current (1µs Pulse) per die F P Peak Inverse Voltage IV T Junction Temperature j T Storage Temperature stg θ Thermal Resistance Power Dissipation diss Notes: ...
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10.0 1.0 0.1 0.0 0.0 0.2 0.4 0 FORWARD VOLTAGE (V) F Figure 1. Forward Current vs. Forward Voltage 2.5 2.0 1.5 ...
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QFN 2x2 Package Dimension Pin 1 Dot By Marking 2.000±0.050 6Px 2.000±0.050 Top View 0.800±0.050 Exp.DAP 0.500 Bsc 1.600±0.050 Exp.DAP 0.250±0.050 0.250 Bottom View Note: 1. All dimensions in millimeters. 2. Dimensions are inclusive of plating. 3. Dimensions are exclusive ...
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... PCB Land Pattern B (top view) Note : 1. All dimensions in millimeters (mils). 2. For PCB land pattern B and stencil layout B, external trace is required to connect all cathode pads as one single pad. Ordering Information Part Number No. of Devices HSMP-386J-TR1G 3000 HSMP-386J-TR2G 10000 HSMP-386J-BLKG 100 5 1.00 ...
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Device Orientation REEL USER FEED DIRECTION COVER TAPE Tape Dimensions 10° Max A 0 DESCRIPTION CAVITY LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER PERFORATION DIAMETER PITCH POSITION CARRIER TAPE WIDTH THICKNESS COVER TAPE WIDTH TAPE ...