04801141414 3M Interconnect Solutions, 04801141414 Datasheet - Page 4

• Manufacturer Part Number: 04801141414
• Description: Conn Hard Metric SKT 8Power POS 2mm Press Fit RA Thru-Hole
• Manufacturer: 3M Interconnect Solutions
• Type: Hard Metricr

Specifications of 04801141414

• Pitch: 2 mm
• Number Of Rows: 4
• Number Of Contacts: 8Power
• Termination Method: Press Fit
• Mounting: Through Hole
• Contact Plating: Gold Over Palladium Nickel Over Nickel

3M
2 mm 4/5-Row, Right Angle, Solder or Press-Fit Tail
3
Electronic Solutions Division
Interconnect Solutions
http://www.3M.com/interconnects
HOLE
“D”
Recommended 4 Row PCB Hole
™
2.00
.079
MetPak
TYP.
"B"
“D” PLATED THROUGH-HOLE
2.00
.079
HOLE
Finished Dia.
[.0276-.0315]
0.700-0.800
“D”
mm [in]
Mounting Pattern
3X
Ø
0.10
0.65-0.80 [.0256-.0315]
Finished Dia.
Table 4 -- HOLE PLATING for TG, TG30, TR30, TR40B FINISHES ONLY
Cu Thickness
[0.001-0.002]
Table 5 -- HOLE PLATING for FJ, KR, RF, LR and PD FINISHES ONLY
™
0.025-0.045
mm [in]
mm [in]
2-FB Power Socket
A1
6.00
.236
Immersion Matte
4.00
.157
Sn Thickness
microns [μ”]
[20 - 100]
0.5 - 2.5
3.00
.118
0.025 [.001] min
Cu Thickness
4.00
.157
1.00
.039
mm [in]
UNPLATED THRU HOLE
Ø
UNPLATED THROUGH-HOLE
Ø
UNPLATED THROUGH-HOLE
2.05
.081
1.50
.059
+.05
-.00
+.002
-.000
Electrolitic Au
microns [μ”]
+.10
-.00
+.004
-.000
Thickness
0.1 - 0.5
[4 - 20]
Recommended 5 Row PCB Hole
SnPb Thickness
Ø
15 [600] max
microns [µ”]
0.10
Ø
0.10
OSP ENTEK
microns [μ”]
Mounting Pattern
Thickness
4X
0.2 - 0.5
[8 - 20]
2.00
.079
For technical, sales or ordering information call
0.81-0.86 [.0319-.0339]
Drilled Hole Dia.
3M is a trademark of 3M Company.
0.85mm [ #66] TWIST DRILL
0.830-0.860 [.0330-.0340] or
8.00
.315
mm [in]
Drilled Hole Dia.
mm [in]
MP2 Series
800-225-5373
Sheet 4 of 4
TS-1125-B