1-776228-1 Tyco Electronics, 1-776228-1 Datasheet - Page 7

• Manufacturer Part Number: 1-776228-1
• Description: Conn Wire to Board HDR 23 POS 4mm Solder ST Thru-Hole Loose Piece
• Manufacturer: Tyco Electronics
• Type: Wire to Boardr
• Series: AMPSEALr

Specifications of 1-776228-1

• Pitch: 4 mm
• Number Of Rows: 3
• Number Of Contacts: 23
• Gender: HDR
• Contact Plating: Gold
• Termination Method: Solder
• Contact Type: Male Pin
• Connector Type: Header, Shrouded
• Number Of Positions: 23
• Number Of Positions Loaded: All
• Row Spacing: 0.157" (4.00mm)
• Mounting Type: Panel Mount; Through Hole
• Termination: Solder
• Fastening Type: Ramp
• Contact Finish: Gold
• Color: Black
• Product: Pin Headers
• Contact Material: Brass
• Mounting Method: Plug
• Mounting Style: Through Hole
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Contact Finish Thickness: -
• Contact Mating Length: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

AMPSEAL Sealed Connector Series
Housings and Connectors
Introduction
The housings use a two-piece
contact-holding design that
provides secondary locking
which protects against contact
backout.
After contacts are inserted
into the housing, the locking
wedge is seated to firmly
position all contacts.
All specifications subject to change. Consult Tyco Electronics for latest specifications.
The connectors use three-row
contact grid on 4.0 centerlines.
Mat seals contain a sealing
diaphram within each circuit
cavity which is broken when
terminals are inserted. If termi-
nal is removed a sealing plug
should be installed to reseal
the circuit.
The pc board-mounting
connector is designed to be
flange mounted.
Available with or without a
formed in place flange seal.
Product Features
I
I
I
I
I
I
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Mechanical and colored
keying
UL 94 V-0 rated materials
Integrated terminal position
assurance
Fully sealed and
submersible IP 67 rating
Available in vertical or
right-angle
Contains integrated PCB
retention feature
IEC IP 67 rated
Main Catalog 1654400-1
Chapter 29 – Issued
Revised
12-2009.
3-2010.
29-7