MBT3906DW1T1G ON Semiconductor, MBT3906DW1T1G Datasheet

TRANS DUAL GP 200MA 40V SC88

MBT3906DW1T1G

Manufacturer Part Number
MBT3906DW1T1G
Description
TRANS DUAL GP 200MA 40V SC88
Manufacturer
ON Semiconductor
Datasheet

Specifications of MBT3906DW1T1G

Transistor Type
2 PNP (Dual)
Current - Collector (ic) (max)
200mA
Voltage - Collector Emitter Breakdown (max)
40V
Vce Saturation (max) @ Ib, Ic
400mV @ 5mA, 50mA
Dc Current Gain (hfe) (min) @ Ic, Vce
100 @ 10mA, 1V
Power - Max
150mW
Frequency - Transition
250MHz
Mounting Type
Surface Mount
Package / Case
SC-70-6, SC-88, SOT-363
Configuration
Dual
Transistor Polarity
NPN
Mounting Style
SMD/SMT
Collector- Emitter Voltage Vceo Max
40 V
Emitter- Base Voltage Vebo
5 V
Continuous Collector Current
- 200 mAdc
Maximum Dc Collector Current
0.2 A
Power Dissipation
150 mW
Maximum Operating Frequency
250 MHz
Maximum Operating Temperature
+ 150 C
Dc Collector/base Gain Hfe Min
60 at 0.1 mA at 1 V
Minimum Operating Temperature
- 55 C
Number Of Elements
2
Collector-emitter Voltage
40V
Collector-base Voltage
40V
Emitter-base Voltage
5V
Collector Current (dc) (max)
200mA
Frequency (max)
250MHz
Operating Temp Range
-55C to 150C
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
6
Package Type
SOT-363
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Collector Cutoff (max)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
MBT3906DW1T1GOSTR

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MBT3906DW1T1G
Dual General Purpose
Transistor
SOT−23/SOT−323 three−leaded device. It is designed for general
purpose amplifier applications and is housed in the SOT−363
six−leaded surface mount package. By putting two discrete devices in
one package, this device is ideal for low−power surface mount
applications where board space is at a premium.
Features
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Device mounted on FR4 glass epoxy printed circuit board using the minimum
© Semiconductor Components Industries, LLC, 2009
October, 2009 − Rev. 3
MAXIMUM RATINGS
THERMAL CHARACTERISTICS
Collector −Emitter Voltage
Collector −Base Voltage
Emitter −Base Voltage
Collector Current − Continuous
Electrostatic Discharge
Total Package Dissipation (Note 1)
Thermal Resistance,
Junction and Storage
The MBT3906DW1T1G device is a spin−off of our popular
Compliant
h
Low V
Simplifies Circuit Design
Reduces Board Space
Reduces Component Count
Available in 8 mm, 7−inch/3,000 Unit Tape and Reel
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
recommended footprint.
FE
T
Junction−to−Ambient
Temperature Range
A
, 100−300
= 25°C
CE(sat)
Characteristic
Rating
, ≤ 0.4 V
Symbol
Symbol
T
V
V
V
ESD
R
J
P
, T
CEO
CBO
EBO
I
qJA
C
D
stg
−55 to +150
Value
−200
−5.0
Max
−40
−40
150
833
HBM Class 2
MM Class B
1
mAdc
°C/W
Unit
Unit
Vdc
Vdc
Vdc
mW
°C
†For information on tape and reel specifications,
MBT3906DW1T1G SOT−363
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Device
(Note: Microdot may be in either location)
Q
ORDERING INFORMATION
(4)
(3)
1
MARKING DIAGRAM
A2 = Device Code
M = Date Code
G = Pb−Free Package
http://onsemi.com
SOT−363/SC−88
6
1
CASE 419B
(Pb−Free)
STYLE 1
Package
A2 M G
(5)
Publication Order Number:
G
1
(2)
MBT3906DW1T1/D
Tape & Reel
Shipping
(1)
(6)
3000 /
Q
2

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MBT3906DW1T1G Summary of contents

Page 1

... MBT3906DW1T1G Dual General Purpose Transistor The MBT3906DW1T1G device is a spin−off of our popular SOT−23/SOT−323 three−leaded device designed for general purpose amplifier applications and is housed in the SOT−363 six−leaded surface mount package. By putting two discrete devices in one package, this device is ideal for low−power surface mount applications where board space premium ...

Page 2

ELECTRICAL CHARACTERISTICS Characteristic OFF CHARACTERISTICS Collector −Emitter Breakdown Voltage (Note 2) Collector −Base Breakdown Voltage Emitter −Base Breakdown Voltage Base Cutoff Current Collector Cutoff Current ON CHARACTERISTICS (Note 2) DC Current Gain (I = −0.1 mAdc −1.0 Vdc) ...

Page 3

10.6 V 300 ns DUTY CYCLE = 2% Figure 1. Delay and Rise Time Equivalent Test Circuit TYPICAL TRANSIENT CHARACTERISTICS 10 7.0 5.0 C obo C ibo 3.0 2.0 1.0 0.1 0.2 0.3 ...

Page 4

TYPICAL AUDIO SMALL−SIGNAL CHARACTERISTICS (V CE 5.0 SOURCE RESISTANCE = 200 1 4.0 SOURCE RESISTANCE = 200 0 3.0 SOURCE RESISTANCE = 2 2.0 ...

Page 5

TYPICAL STATIC CHARACTERISTICS 2.0 1.0 0.7 0.5 0.3 0.2 0.1 0.1 0.2 0.3 0.5 0.7 1.0 1 0.6 0.4 0.2 0 0.01 0.02 0.03 0.05 0.07 1 25° ...

Page 6

... Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein ...

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