MIT-019-05-F-D Samtec Inc, MIT-019-05-F-D Datasheet

MIT-019-05-F-D

Manufacturer Part Number

MIT-019-05-F-D

Description

Conn Micro High Speed Terminal Strip HDR 38 POS 0.64mm Solder ST Thru-Hole/SMD

Manufacturer

Samtec Inc

Type

Micro High Speed Terminal Stripr

Datasheet

1.MIT-019-05-F-D.pdf (1 pages)

Specifications of MIT-019-05-F-D

Pitch

0.64 mm

Number Of Rows

Number Of Contacts

Gender

HDR

Contact Plating

Gold Over Nickel

Termination Method

Solder

Lead Free Status / RoHS Status

Current page: 1 of 1
Download datasheet (467Kb)

For complete speciﬁ cations and

recommended PCB layouts see

www.samtec.com?MIT

Insulator Material:

Liquid Crystal

Polymer

Contact Material:

Phosphor Bronze

Plating:

Au or Sn over 50µ" (1,27µm) Ni

Current Rating:

Contacts: 1.6A @ 80°C

Ground Plane: 8.7A @ 80°C

Operating Temp Range:

-55°C to +125°C

Voltage Rating:

275 VAC

Max Cycles:

100

RoHS Compliant:

Yes

Processing:

Lead–Free Solderable:

Yes

SMT Lead Coplanarity:

(0,10mm) .004" max (019-076)

Board Stacking:

For applications requiring

more than two connectors per

board or 76 positions or higher,

contact ipg@samtec.com

*Note: –C Plating passes

10 year MFG testing

Note: Some lengths, styles

and options are non-standard,

non-returnable.

THROUGH-HOLE GROUND PLANE HEADER

F-211

SPECIFIC OPTION

• 11mm, 16mm, 18,75mm

• 30µ" (0,76µm) Gold

• Differential Pair and

• 95, 114 and 133

• Edge Mount

Call Samtec.

SPECIFICATIONS

(0,635mm) .025"

MIT SERIES

and 22mm stack height

“Partitionable” (combine

differential & single-

ended banks in same

connector) available.

positions per row

APPLICATION

Board Mates:

MIS

Cable Mates:

MICD

5mm Stack Height

Single-Ended Signaling

Differential Pair Signaling

Performance data for other stack heights and complete

test data available at www.samtec.com?MIT or contact

sig@samtec.com

MIT

(7,11)

(1,40)

.055

.280

Note: Rugged through-hole ground plane soldered to board

(requires paste-over-hole, not press ﬁ t) for added retention to PCB.

–019, –038, –057, –076

(38 total positions per bank)

(No. of Positions/19) x (12,70) .500 + (11,43) .450

NO. OF POSITIONS

(12,70)

(0,635)

.500

.025

Type

–DP

PER ROW

–D

• Mixed

technology

footprint

(0,58) .023 x (0,38) .015

Rated @ 3dB Insertion Loss

Integral metal plane

for power or ground

WWW.SAMTEC.COM

MIT–038–01–F–D

8.5 GHz / 17 Gbps

9.5 GHz / 19 Gbps

(0,20)

.008

Specify

STYLE

LEAD

chart

from

(5,97)

.235

(3,81µm) Ni on Signal Pins in contact

in contact area, Matte Tin over 50µ"

50µ" (1,27µm) Ni on Ground Plane

(0,38)

(1,27µm) min Ni on all solder tails

50µ" (1,27µm) min Au over 150µ"

= Gold Flash on Signal Pins and

.015

Ground Plane, Matte Tin on tails

area, 10µ" (0,25µm) min Au over

Signal Pins and Ground Plane,

MIT–076–01–L–D

= Electro-Polished Selective

PLATING

Polarized

OPTION

= 10µ" (0,25µm) Gold on

(7,11)

.280

Matte Tin on tails

–C*

–F

–L

76 signal lines

per linear inch

ALSO AVAILABLE

Board Spacing Standoffs.

MIT–019–01–F–D

STYLE

LEAD

Processing conditions will

affect mated height.

–01

–02

See SO Series.

STACK HEIGHTS

(4,27) .168

(7,26) .286

Choice of

mated heights

OPTION

= (7,00mm)

OTHER

ﬁ lm Pick &

Polyimide

Place Pad

.275" DIA

= Tape &

–TR

(5,00) .197

(8,00) .315

–K

HEIGHT

Reel

MATED

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