BC847BPN,115 NXP Semiconductors, BC847BPN,115 Datasheet - Page 3

• Manufacturer Part Number: BC847BPN,115
• Description: TRANS NPN/PNP 100MA 45V SOT363
• Manufacturer: NXP Semiconductors

Specifications of BC847BPN,115

• Package / Case: SC-70-6, SC-88, SOT-363
• Transistor Type: NPN, PNP
• Current - Collector (ic) (max): 100mA
• Voltage - Collector Emitter Breakdown (max): 45V
• Vce Saturation (max) @ Ib, Ic: 300mV @ 5mA, 100mA
• Dc Current Gain (hfe) (min) @ Ic, Vce: 200 @ 2mA, 5V
• Power - Max: 300mW
• Frequency - Transition: 100MHz
• Mounting Type: Surface Mount
• Minimum Operating Temperature: - 65 C
• Configuration: Dual
• Transistor Polarity: NPN/PNP
• Mounting Style: SMD/SMT
• Collector- Emitter Voltage Vceo Max: 45 V
• Emitter- Base Voltage Vebo: 5 V
• Maximum Dc Collector Current: 0.1 A
• Power Dissipation: 200 mW
• Maximum Operating Frequency: 100 MHz
• Maximum Operating Temperature: + 150 C
• Number Of Elements: 2
• Collector-emitter Voltage: 45V
• Collector-base Voltage(max): 50V
• Emitter-base Voltage (max): 5V
• Collector Current (dc) (max): 100mA
• Dc Current Gain (min): 200
• Frequency (max): 100MHz
• Operating Temp Range: -65C to 150C
• Operating Temperature Classification: Military
• Mounting: Surface Mount
• Pin Count: 6
• Package Type: SOT-363
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Collector Cutoff (max): -
• Lead Free Status / Rohs Status: Compliant
• Other names: 568-1634-2; 934042530115; BC847BPN T/R

NXP Semiconductors
6. Thermal characteristics
BC847BPN_4
Product data sheet
Table 6.
[1]
[2]
Symbol
Per transistor
R
R
Per device
R
Fig 1.
th(j-a)
th(j-sp)
th(j-a)
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm
(1) FR4 PCB, mounting pad for collector 1 cm
(2) FR4 PCB, standard footprint
Per device: Power derating curves SOT363 (SC-88)
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to solder point
thermal resistance from
junction to ambient
(mW)
Rev. 04 — 18 February 2009
P
tot
500
400
300
200
100
0
75
25
(1)
(2)
45 V, 100 mA NPN/PNP general-purpose transistor
Conditions
in free air
in free air
25
2
75
125
[1]
[2]
[1]
[2]
T
006aab419
amb
Min
-
-
-
-
-
( C)
175
BC847BPN
Typ
-
-
-
-
-
© NXP B.V. 2009. All rights reserved.
Max
568
500
230
416
313
2
Unit
K/W
K/W
K/W
K/W
K/W
.
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