74HCT244D NXP Semiconductors, 74HCT244D Datasheet

Buffer/Line Driver 8-CH Non-Inverting 3-ST CMOS 20-Pin SO Bulk

74HCT244D

Manufacturer Part Number

74HCT244D

Description

Buffer/Line Driver 8-CH Non-Inverting 3-ST CMOS 20-Pin SO Bulk

Manufacturer

NXP Semiconductors

Datasheet

1.74HCT244D653.pdf (22 pages)

Specifications of 74HCT244D

Package

20SO

Logic Family

HCT

Logic Function

Buffer/Line Driver

Number Of Outputs Per Chip

Output Type

3-State

Input Signal Type

Single-Ended

Maximum Propagation Delay Time @ Maximum Cl

22@4.5V ns

Polarity

Non-Inverting

Logic Device Type

Buffer/Line Driver, Non Inverting

Supply Voltage Range

4.5V To 5.5V

Logic Case Style

SOIC

No. Of Pins

Operating Temperature Range

-40Â°C To +125Â°C

No. Of Circuits

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

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Download datasheet (128Kb)

1. General description

2. Features

3. Quick reference data

The 74HC244; 74HCT244 is a high-speed Si-gate CMOS device and is pin compatible

with Low-power Schottky TTL (LSTTL).

The 74HC244; 74HCT244 has octal non-inverting buffer/line drivers with 3-state outputs.

The 3-state outputs are controlled by the output enable inputs 1OE and 2OE. A HIGH on

nOE causes the outputs to assume a high-impedance OFF-state. The 74HC244;

74HCT244 is identical to the 74HC240; 74HCT240 but has non-inverting outputs.

Table 1:

GND = 0 V; T

[1]

Symbol Parameter

74HC244

74HCT244

PHL

PLH

PHL

PLH

74HC244; 74HCT244

Octal buffer/line driver; 3-state

Rev. 03 — 22 December 2005

Octal bus interface

Non-inverting 3-state outputs

Complies with JEDEC standard no. 7A

ESD protection:

Multiple package options

Speciﬁed from 40 C to +85 C and from 40 C to +125 C

HBM EIA/JESD22-A114-C exceeds 2000 V

MM EIA/JESD22-A115-A exceeds 200 V

= C

is used to determine the dynamic power dissipation (P

propagation delay

nAn to nYn

input capacitance

power dissipation

capacitance

propagation delay

nAn to nYn

input capacitance

power dissipation

capacitance

Quick reference data

amb

= 25 C; t

N + (C

= t

= 6 ns

Conditions

per buffer; V

= 5 V; C

1.5 V)

) where:

= GND to

= 15 pF

in W):

[1]

Product data sheet

Min

Typ

3.5

Max

Unit

Related parts for 74HCT244D

74HCT244D Summary of contents

Page 1

... The 74HC244; 74HCT244 is a high-speed Si-gate CMOS device and is pin compatible with Low-power Schottky TTL (LSTTL). The 74HC244; 74HCT244 has octal non-inverting buffer/line drivers with 3-state outputs. The 3-state outputs are controlled by the output enable inputs 1OE and 2OE. A HIGH on nOE causes the outputs to assume a high-impedance OFF-state. The 74HC244; ...

Page 2

... Type number Package Temperature range Name 74HC244 74HC244N +125 C 74HC244D +125 C 74HC244DB +125 C 74HC244PW +125 C 74HC244BQ +125 C 74HCT244 74HCT244N +125 C 74HCT244D +125 C 74HCT244DB +125 C 74HCT244PW +125 C 74HCT244BQ +125 C 74HC_HCT244_3 Product data sheet = supply voltage sum of outputs Description DIP20 plastic dual in-line package; 20 leads (300 mil) SO20 plastic small outline package ...

Page 3

Philips Semiconductors 5. Functional diagram Fig 1. Functional diagram 2 18 1A0 1Y0 2A0 4 16 1A1 2A1 1Y1 6 14 1A2 2A2 1Y2 8 12 1A3 1Y3 2A3 1 1OE 2OE Fig 2. Logic symbol 74HC_HCT244_3 Product data sheet ...

Page 4

Philips Semiconductors 6. Pinning information 6.1 Pinning 1OE 1A0 2Y0 1A1 2Y1 1A2 2Y2 1A3 2Y3 GND Fig 4. Pin conﬁguration DIP20, SO20, 6.2 Pin description Table 3: Symbol 1OE 1A0 2Y0 1A1 2Y1 1A2 2Y2 1A3 2Y3 GND 2A3 ...

Page 5

Philips Semiconductors Table 3: Symbol 2A1 1Y1 2A0 1Y0 2OE Functional description 7.1 Function table Table 4: Control nOE HIGH voltage level LOW voltage level don’t care; Z ...

Page 6

Philips Semiconductors [1] For DIP20 package: P [2] For SO20 package: P [3] For SSOP20 and TSSOP20 packages: P [4] For DHVQFN20 packages Recommended operating conditions Table 6: Symbol 74HC244 amb ...

Page 7

Philips Semiconductors Table 7: Static characteristics 74HC244 At recommended operating conditions; voltages are referenced to GND (ground = 0V). Symbol Parameter V LOW-state output voltage OL I input leakage current LI I OFF-state output current OZ I quiescent supply current ...

Page 8

Philips Semiconductors Table 7: Static characteristics 74HC244 At recommended operating conditions; voltages are referenced to GND (ground = 0V). Symbol Parameter +125 C amb V HIGH-state input voltage IH V LOW-state input voltage IL V ...

Page 9

Philips Semiconductors Table 8: Static characteristics 74HCT244 At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter I additional quiescent supply CC current C input capacitance +85 C amb ...

Page 10

Philips Semiconductors 11. Dynamic characteristics Table 9: Dynamic characteristics 74HC244 GND = ns unless otherwise speciﬁed; for test circuit see Symbol Parameter ...

Page 11

Philips Semiconductors Table 9: Dynamic characteristics 74HC244 GND = ns unless otherwise speciﬁed; for test circuit see Symbol Parameter +125 C ...

Page 12

Philips Semiconductors Table 10: Dynamic characteristics type 74HCT244 GND = ns unless otherwise speciﬁed; for test circuit see Symbol Parameter +85 ...

Page 13

Philips Semiconductors Fig 7. 3-state enable and disable times Table 11: Type 74HC244 74HCT244 74HC_HCT244_3 Product data sheet V I nOE input V M GND t PLZ V CC nYn output LOW-to-OFF OFF-to-LOW PHZ V OH nYn ...

Page 14

Philips Semiconductors Fig 8. Load circuitry for switching times Table 12: Type 74HC244 74HCT244 74HC_HCT244_3 Product data sheet negative V M pulse positive V ...

Page 15

Philips Semiconductors 13. Package outline DIP20: plastic dual in-line package; 20 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. ...

Page 16

Philips Semiconductors SO20: plastic small outline package; 20 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. ...

Page 17

Philips Semiconductors SSOP20: plastic shrink small outline package; 20 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1.80 mm ...

Page 18

Philips Semiconductors TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm ...

Page 19

Philips Semiconductors DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 20 terminals; body 2.5 x 4.5 x 0.85 mm terminal 1 index area terminal 1 index area ...

Page 20

Philips Semiconductors 14. Abbreviations Table 13: Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model LSTTL Low-power Schottky Transistor-Transistor Logic MM Machine Model 15. Revision history Table 14: Revision history ...

Page 21

Philips Semiconductors 16. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualiﬁcation III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...

Page 22

Philips Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...

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