S71GL016A40BAW1J0 Spansion Inc., S71GL016A40BAW1J0 Datasheet - Page 3

• Manufacturer Part Number: S71GL016A40BAW1J0
• Description: Combo Mem 1Mx16 Flash + 256Kx16 PSRAM 3V 56-Pin FBGA Tray
• Manufacturer: Spansion Inc.

Specifications of S71GL016A40BAW1J0

• Package: 56FBGA
• Organization: 1Mx16 Flash + 256Kx16 PSRAM
• Operating Supply Voltage: 3 V
• Operating Temperature: -25 to 85 °C

Features
General Description
The S71GL series is a product line of stacked Multi-Chip Product (MCP) packages and consists of:
The products covered by this document are listed in the table below:
For detailed specifications, please refer to the individual data sheets.
This document contains information on one or more products under development at Spansion LLC. The information is intended to help you evaluate this product. Do not design
in this product without contacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice.
.
S71GL016A Based MCPs
Stacked Multi-Chip Product (MCP) Flash Memory and
RAM
16 Megabit (1M x 16-bit) CMOS 3.0 Volt-only Page Mode Flash
Memory
4 Megabit (256K x 16-bit) pSRAM
Data Sheet (Advance Information)
Power supply voltage of 2.7 V to 3.1 V
High performance
– 100 ns (100 ns Flash, 70 ns pSRAM/SRAM)
One S29GL016A Flash memory die
pSRAM
Publication Number S71GL016A_00
pSRAM Density
pSRAM Type 4
Document
S29GL-A
Revision A
4Mb
Packages
– 7 x 9 x 1.2 mm 56 ball FBGA
Operating Temperature
– –25°C to +85°C
Amendment 1
Publication Identification Number (PID)
Issue Date June 20, 2006
Flash Memory Density
S71GL016A40
S29GL-A_00
psram_18
16Mb