MT47H32M16HR-3 IT:F TR Micron Technology Inc, MT47H32M16HR-3 IT:F TR Datasheet - Page 90
![DRAM Chip DDR2 SDRAM 512M-Bit 32Mx16 1.8V 84-Pin FBGA T/R](/photos/31/34/313419/mfg557-84-fbga_sml.jpg)
MT47H32M16HR-3 IT:F TR
Manufacturer Part Number
MT47H32M16HR-3 IT:F TR
Description
DRAM Chip DDR2 SDRAM 512M-Bit 32Mx16 1.8V 84-Pin FBGA T/R
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Specifications of MT47H32M16HR-3 IT:F TR
Density
512 Mb
Maximum Clock Rate
667 MHz
Package
84FBGA
Address Bus Width
15 Bit
Operating Supply Voltage
1.8 V
Maximum Random Access Time
0.45 ns
Operating Temperature
-40 to 85 °C
Organization
32Mx16
Address Bus
15b
Access Time (max)
450ps
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
250mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Compliant
READ
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. Q 10/10 EN
READ bursts are initiated with a READ command. The starting column and bank ad-
dresses are provided with the READ command, and auto precharge is either enabled or
disabled for that burst access. If auto precharge is enabled, the row being accessed is
automatically precharged at the completion of the burst. If auto precharge is disabled,
the row will be left open after the completion of the burst.
During READ bursts, the valid data-out element from the starting column address will
be available READ latency (RL) clocks later. RL is defined as the sum of AL and CL:
RL = AL + CL. The value for AL and CL are programmable via the MR and EMR com-
mands, respectively. Each subsequent data-out element will be valid nominally at the
next positive or negative clock edge (at the next crossing of CK and CK#). Figure 44
(page 91) shows examples of RL based on different AL and CL settings.
DQS/DQS# is driven by the DDR2 SDRAM along with output data. The initial LOW state
on DQS and the HIGH state on DQS# are known as the read preamble (
LOW state on DQS and the HIGH state on DQS# coincident with the last data-out ele-
ment are known as the read postamble (
Upon completion of a burst, assuming no other commands have been initiated, the DQ
will go High-Z. A detailed explanation of
window hold), and the valid data window are depicted in Figure 53 (page 99) and Fig-
ure 54 (page 100). A detailed explanation of
t
Data from any READ burst may be concatenated with data from a subsequent READ
command to provide a continuous flow of data. The first data element from the new
burst follows the last element of a completed burst. The new READ command should
be issued x cycles after the first READ command, where x equals BL/2 cycles (see Fig-
ure 45 (page 92)).
Nonconsecutive read data is illustrated in Figure 46 (page 93). Full-speed random
read accesses within a page (or pages) can be performed. DDR2 SDRAM supports the
use of concurrent auto precharge timing (see Table 42 (page 96)).
DDR2 SDRAM does not allow interrupting or truncating of any READ burst using BL = 4
operations. Once the BL = 4 READ command is registered, it must be allowed to com-
plete the entire READ burst. However, a READ (with auto precharge disabled) using BL
= 8 operation may be interrupted and truncated only by another READ burst as long as
the interruption occurs on a 4-bit boundary due to the 4n prefetch architecture of
DDR2 SDRAM. As shown in Figure 47 (page 94), READ burst BL = 8 operations may
not be interrupted or truncated with any other command except another READ com-
mand.
Data from any READ burst must be completed before a subsequent WRITE burst is al-
lowed. An example of a READ burst followed by a WRITE burst is shown in Figure 48
(page 94). The
fined in Figure 56 (page 103)).
AC (data-out transition skew to CK) is shown in Figure 55 (page 101).
t
DQSS (NOM) case is shown (
90
Micron Technology, Inc. reserves the right to change products or specifications without notice.
t
t
RPST).
DQSQ (valid data-out skew),
512Mb: x4, x8, x16 DDR2 SDRAM
t
t
DQSCK (DQS transition skew to CK) and
DQSS [MIN] and
© 2004 Micron Technology, Inc. All rights reserved.
t
DQSS [MAX] are de-
t
QH (data-out
t
RPRE). The
READ