XC3S1200E-4FTG256C Xilinx Inc, XC3S1200E-4FTG256C Datasheet - Page 132

FPGA Spartan®-3E Family 1.2M Gates 19512 Cells 572MHz 90nm (CMOS) Technology 1.2V 256-Pin FTBGA

XC3S1200E-4FTG256C

Manufacturer Part Number
XC3S1200E-4FTG256C
Description
FPGA Spartan®-3E Family 1.2M Gates 19512 Cells 572MHz 90nm (CMOS) Technology 1.2V 256-Pin FTBGA
Manufacturer
Xilinx Inc
Series
Spartan™-3Er
Datasheet

Specifications of XC3S1200E-4FTG256C

Package
256FTBGA
Family Name
Spartan®-3E
Device Logic Cells
19512
Device Logic Units
2168
Device System Gates
1200000
Number Of Registers
17344
Maximum Internal Frequency
572 MHz
Typical Operating Supply Voltage
1.2 V
Maximum Number Of User I/os
190
Ram Bits
516096
Number Of Logic Elements/cells
19512
Number Of Labs/clbs
2168
Total Ram Bits
516096
Number Of I /o
190
Number Of Gates
1200000
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
256-LBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
122-1529
XC3S1200E-4FTG256C

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
XC3S1200E-4FTG256C
Manufacturer:
XILINX
Quantity:
2 024
Part Number:
XC3S1200E-4FTG256C
Manufacturer:
SEMTECH
Quantity:
101
Part Number:
XC3S1200E-4FTG256C
Manufacturer:
XILINX
Quantity:
13
Part Number:
XC3S1200E-4FTG256C
Manufacturer:
ALTERA
Quantity:
1 022
Part Number:
XC3S1200E-4FTG256C
Manufacturer:
Xilinx Inc
Quantity:
10 000
Part Number:
XC3S1200E-4FTG256C
Manufacturer:
XILINX
0
Part Number:
XC3S1200E-4FTG256C
Manufacturer:
XILINX/赛灵思
Quantity:
20 000
Part Number:
XC3S1200E-4FTG256C
0
Part Number:
XC3S1200E-4FTG256C0780
Manufacturer:
XILINX
0
Part Number:
XC3S1200E-4FTG256C0808
Manufacturer:
XILINX
0
DC and Switching Characteristics
Table 93: Timing for the IOB Three-State Path
132
Notes:
1.
2.
3.
Synchronous Output Enable/Disable Times
T
T
Asynchronous Output Enable/Disable Times
T
Set/Reset Times
T
T
IOCKHZ
IOCKON
GTS
IOSRHZ
IOSRON
Symbol
The numbers in this table are tested using the methodology presented in
Table 77
This time requires adjustment whenever a signal standard other than LVCMOS25 with 12 mA drive and Fast slew rate is assigned to the data
Output. When this is true, add the appropriate Output adjustment from
For minimum delays use the values reported by the Timing Analyzer.
(2)
(2)
and
Table
Time from the active transition at the OTCLK
input of the Three-state Flip-Flop (TFF) to
when the Output pin enters the
high-impedance state
Time from the active transition at TFF’s
OTCLK input to when the Output pin drives
valid data
Time from asserting the Global Three State
(GTS) input on the STARTUP_SPARTAN3E
primitive to when the Output pin enters the
high-impedance state
Time from asserting TFF’s SR input to when
the Output pin enters a high-impedance state
Time from asserting TFF’s SR input at TFF to
when the Output pin drives valid data
80.
Description
www.xilinx.com
Table
LVCMOS25,
12 mA output
drive, Fast slew
rate
LVCMOS25,
12 mA output
drive, Fast slew
rate
LVCMOS25,
12 mA output
drive, Fast slew
rate
Table 95
Conditions
94.
and are based on the operating conditions set forth in
Device
All
All
All
All
All
DS312-3 (v3.8) August 26, 2009
Speed Grade
Max
1.49
2.70
8.52
2.11
3.32
-5
Product Specification
Max
1.71
3.10
9.79
2.43
3.82
-4
Units
ns
ns
ns
ns
ns
R

Related parts for XC3S1200E-4FTG256C