XC3S1600E-5FG400C Xilinx Inc, XC3S1600E-5FG400C Datasheet - Page 189
![no-image](/images/no-image-200.jpg)
XC3S1600E-5FG400C
Manufacturer Part Number
XC3S1600E-5FG400C
Description
FPGA Spartan®-3E Family 1.6M Gates 33192 Cells 657MHz 90nm (CMOS) Technology 1.2V 400-Pin FBGA
Manufacturer
Xilinx Inc
Datasheet
1.XC3S100E-4VQG100C.pdf
(233 pages)
Specifications of XC3S1600E-5FG400C
Package
400FBGA
Family Name
Spartan®-3E
Device Logic Cells
33192
Device Logic Units
3688
Device System Gates
1600000
Number Of Registers
29504
Maximum Internal Frequency
657 MHz
Typical Operating Supply Voltage
1.2 V
Maximum Number Of User I/os
304
Ram Bits
663552
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XC3S1600E-5FG400C
Manufacturer:
XILINX
Quantity:
253
Part Number:
XC3S1600E-5FG400C
Manufacturer:
XILINX/赛灵思
Quantity:
20 000
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User I/Os by Bank
Table 142
distributed between the four I/O banks on the PQ208 pack-
age.
Table 142: User I/Os Per Bank for the XC3S250E and XC3S500E in the PQ208 Package
DS312-4 (v3.8) August 26, 2009
Product Specification
Notes:
1.
2.
Top
Right
Bottom
Left
TOTAL
Package
Some VREF and CLK pins are on INPUT pins.
The eight global clock pins in this bank have optional functionality during configuration and are counted in the DUAL column.
Edge
indicates how the 158 available user-I/O pins are
R
I/O Bank
0
1
2
3
Maximum
158
I/O
38
40
40
40
I/O
18
23
58
9
8
www.xilinx.com
Footprint Migration Differences
The XC3S250E and XC3S500E FPGAs have identical foot-
prints in the PQ208 package. Designs can migrate between
the XC3S250E and XC3S500E without further consider-
ation.
INPUT
25
6
7
6
6
All Possible I/O Pins by Type
DUAL
21
24
46
1
0
VREF
13
5
3
2
3
Pinout Descriptions
(1)
CLK
0
0
16
8
8
(2)
(2)
(1)
189
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