XC3S2000-4FG456I Xilinx Inc, XC3S2000-4FG456I Datasheet - Page 122
XC3S2000-4FG456I
Manufacturer Part Number
XC3S2000-4FG456I
Description
FPGA Spartan®-3 Family 2M Gates 46080 Cells 630MHz 90nm Technology 1.2V 456-Pin FBGA
Manufacturer
Xilinx Inc
Datasheet
1.XC3S50-4VQG100C.pdf
(217 pages)
Specifications of XC3S2000-4FG456I
Package
456FBGA
Family Name
Spartan®-3
Device Logic Units
46080
Device System Gates
2000000
Maximum Internal Frequency
630 MHz
Typical Operating Supply Voltage
1.2 V
Maximum Number Of User I/os
333
Ram Bits
737280
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Spartan-3 FPGA Family: Pinout Descriptions
Package Thermal Characteristics
The power dissipated by an FPGA application has implica-
tions on package selection and system design. The power
consumed by a Spartan-3 FPGA is reported using either
the
grated in the Xilinx ISE development software.
vides the thermal characteristics for the various Spartan-3
package offerings.
The junction-to-case thermal resistance (θ
difference between the temperature measured on the pack-
122
XPower
Estimator (XPE) or the XPower Analyzer inte-
JC
) indicates the
Table 85
www.xilinx.com
pro-
age body (case) and the die junction temperature per watt
of power consumption. The junction-to-board (θ
similarly reports the difference between the board and junc-
tion temperature. The junction-to-ambient (θ
reports the temperature difference per watt between the
ambient environment and the junction temperature. The θ
value is reported at different air velocities, measured in lin-
ear feet per minute (LFM). The “Still Air (0 LFM)” column
shows the θ
resistance drops with increasing air flow.
JA
value in a system without a fan. The thermal
DS099-4 (v2.5) December 4, 2009
Product Specification
JA
JB
) value
) value
JA
R
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