XC3S700AN-5FGG484C Xilinx Inc, XC3S700AN-5FGG484C Datasheet - Page 5
![FPGA Spartan®-3AN Family 700K Gates 13248 Cells 770MHz 90nm Technology 1.2V 484-Pin FBGA](/photos/6/72/67299/pk081-484_sml.jpg)
XC3S700AN-5FGG484C
Manufacturer Part Number
XC3S700AN-5FGG484C
Description
FPGA Spartan®-3AN Family 700K Gates 13248 Cells 770MHz 90nm Technology 1.2V 484-Pin FBGA
Manufacturer
Xilinx Inc
Series
Spartan™-3ANr
Datasheets
1.XC3S50A-4VQG100C.pdf
(7 pages)
2.XC3S50AN-4TQG144C.pdf
(2 pages)
3.XC3S50AN-4TQG144C.pdf
(123 pages)
Specifications of XC3S700AN-5FGG484C
Package
484FBGA
Family Name
Spartan®-3AN
Device Logic Units
13248
Device System Gates
700000
Maximum Internal Frequency
770 MHz
Typical Operating Supply Voltage
1.2 V
Maximum Number Of User I/os
372
Ram Bits
368640
Number Of Logic Elements/cells
13248
Number Of Labs/clbs
1472
Total Ram Bits
368640
Number Of I /o
372
Number Of Gates
700000
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
484-BBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
122-1528 - KIT STARTER SPARTAN-3 AN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XC3S700AN-5FGG484C
Manufacturer:
XILINX
Quantity:
748
Company:
Part Number:
XC3S700AN-5FGG484C
Manufacturer:
Xilinx Inc
Quantity:
10 000
Ordering Information
The Extended Spartan-3A family is available in both standard and Pb-free packaging options for all options of the
Spartan-3A devices and the Spartan-3A DSP devices, and for most options of the Spartan-3AN devices (see DS557,
Spartan-3AN FPGA Family: Introduction and Ordering Information for details).The Pb-free packages include a “G” character
in the ordering code (see
X-Ref Target - Figure 3
Notes:
1.
DS706 (v1.1) February 2, 2011
Product Specification
XC3S50A/AN
XC3S200A/AN
XC3S400A/AN
XC3S700A/AN
XC3S1400A/AN
XC3SD1800A
XC3SD3400A
The –5 speed grade is exclusively available in the Commercial temperature range.
Device
R
–4 Standard Performance
–5 High Performance
Speed Grade
Figure
3).
Device Type
Speed Grade
Package Type/Number of Pins
Temperature Range
VQ(G)100 100-pin Very Thin Quad Flat Pack (VQFP)
FT(G)256
TQ(G)144 144-pin Thin Quad Flat Pack (TQFP)
FG(G)320 320-ball Fine-Pitch Ball Grid Array (FBGA)
FG(G)400 400-ball Fine-Pitch Ball Grid Array (FBGA)
CS(G)484 484-ball Chip-Scale Ball Grid Array (FBGA)
FG(G)484 484-ball Fine-Pitch Ball Grid Array (FBGA)
FG(G)676 676-ball Fine-Pitch Ball Grid Array (FBGA)
Figure 3: Ordering Information
Example:
256-ball Fine-Pitch Thin Ball Grid Array (FTBGA)
Package Type / Number of Pins
www.xilinx.com
XC3S50A -4 FTG256 C
DS706_03_072508
Extended Spartan-3A Family Overview
C
LI
I
Temperature Range (T
Commercial (0°C to 85°C)
Industrial (–40°C to 100°C)
Low Power Industrial (–40°C
to 100°C) for Spartan-3A
DSP devices (see DS610,
Spartan-3A DSP FPGA Data
Sheet)
J
)
5