MCT06030D2002BP500 Vishay, MCT06030D2002BP500 Datasheet - Page 3

• Manufacturer Part Number: MCT06030D2002BP500
• Description: Res Thin Film 0603 20K Ohm 0.1% 1/10W ±25ppm/°C Molded SMD Paper T/R
• Manufacturer: Vishay
• Type: Thin Filmr
• Series: MCT 0603r

Specifications of MCT06030D2002BP500

• Case Size: 0603
• Resistance Value: 20 KOhm
• Power Rating: 1/10 W
• Tolerance: 0.1 %
• Resistance (ohms): 20K
• Number Of Terminations: 2
• Package / Case: 0603 (1608 Metric)
• Power (watts): 0.1W, 1/10W
• Composition: Thin Film
• Temperature Coefficient: ±25ppm/°C
• Size / Dimension: 0.061" L x 0.033" W (1.55mm x 0.85mm)
• Height: 0.018" (0.45mm)
• Lead Style: Surface Mount (SMD - SMT)
• Resistance In Ohms: 20.0K
• Case: 0603 (1608 metric)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 2312 216 72003; 2312 216 72003; 231221672003; MCT0603-20K-DBTR

MCS 0402, MCT 0603, MCU 0805, MCA 1206 - Precision
Vishay Beyschlag
DIMENSIONS
SOLDER PAD DIMENSIONS
Note
• The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or in
www.vishay.com
210
DIMENSIONS AND MASS
TYPE
MCS 0402
MCT 0603
MCU 0805
MCA 1206
RECOMMENDED SOLDER PAD DIMENSIONS
TYPE
MCS 0402
MCT 0603
MCU 0805
MCA 1206
publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many other
parameters.
Still, the given solder pad dimensions will be found adequate for most general applications, e.g. those referring to “standard operation mode”.
0.45 + 0.1/- 0.05
0.45 + 0.1/- 0.05
0.32 ± 0.05
0.55 ± 0.1
(mm)
0.55
0.80
1.40
(mm)
G
-
H
WAVE SOLDERING
(mm)
3.2 + 0.1/- 0.2
1.10
1.25
1.50
1.55 ± 0.05
Y
-
1.0 ± 0.05
2.0 ± 0.1
H
For technical questions, contact:
(mm)
W W
L
Precision Thin Film Chip Resistors
T
(mm)
1.10
1.50
1.90
T
X
2
-
1.25 ± 0.15
0.5 ± 0.05
0.85 ± 0.1
1.6 ± 0.15
(mm)
W
T
1
Z
(mm)
2.75
3.30
4.40
L
Z
-
> 75 % of W
> 75 % of W
> 75 % of W
> 75 % of W
G
[e-mail]
(mm)
W
T
Y
(mm)
0.35
0.65
0.90
1.50
G
0.2 + 0.1/- 0.15
0.3 + 0.15/- 0.2
0.4 + 0.1/- 0.2
0.5 ± 0.25
(mm)
T
1
REFLOW SOLDERING
X
(mm)
0.55
0.70
0.90
1.15
Y
0.3 + 0.15/- 0.2
0.4 + 0.1/- 0.2
0.5 ± 0.25
0.2 ± 0.1
(mm)
T
Document Number: 28700
(mm)
2
0.55
0.95
1.40
1.75
X
Revision: 18-Dec-09
MASS
(mm)
(mg)
1.45
2.05
2.70
3.80
0.6
4.6
9.2
1.9
Z