MAX9994ETP+ Maxim Integrated Products, MAX9994ETP+ Datasheet - Page 2

• Manufacturer Part Number: MAX9994ETP+
• Description: Up-Down Converters IC MIXER DOWN CONV 1700MHz to 2200MHz
• Manufacturer: Maxim Integrated Products

Specifications of MAX9994ETP+

• Maximum Input Frequency: 2200 MHz
• Maximum Power Dissipation: 1800 mW
• Mounting Style: SMD/SMT
• Maximum Operating Frequency: 350 MHz
• Maximum Power Gain: 9.2 dB
• Operating Supply Voltage: 5 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Package / Case: TQFN-20 EP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
V
IF+, IF-, LOBIAS, LOSEL, IFBIAS to GND...-0.3V to (V
TAP ........................................................................-0.3V to +1.4V
LO1, LO2, LEXT to GND........................................-0.3V to +0.3V
RF, LO1, LO2 Input Power .............................................+12dBm
RF (RF is DC shorted to GND through a balun) .................50mA
Continuous Power Dissipation (T
SiGe High-Linearity, 1400MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
Note 2: T
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
( Typical Application Circuit , V
chokes, R
otherwise noted.)
RECOMMENDED AC OPERATING CONDITIONS
2
RF Frequency Range
LO Frequency Range
IF Frequency Range
LO Drive Level
CC
Supply Voltage
Supply Current
LO_SEL Input Logic-Low
LO_SEL Input Logic-High
20-Pin Thin QFN-EP (derate 20mW/°C above +70°C)..............1.8W
_______________________________________________________________________________________
to GND ...........................................................-0.3V to +5.5V
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
C
1
PARAMETER
PARAMETER
is the temperature on the exposed pad of the package.
= 806Ω, R
2
= 549Ω, T
CC
A
= +4.75V to +5.25V, no RF signal applied, IF+ and IF- outputs pulled up to V
= +70°C)
C
= -40°C to +85°C, unless otherwise noted. Typical values are at V
SYMBOL
SYMBOL
V
P
I
V
f
f
V
CC
f
RF
LO
CC
LO
IF
IH
IL
(Note 3)
(Note 3)
(Note 3)
(Note 3)
CC
+ 0.3V)
CONDITIONS
CONDITIONS
θ
θ
Operating Temperature Range (Note 2) .....T
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering 10s) ..................................+300°C
Soldering Temperature (reflow) .......................................+260°C
JA
JC
(Note 1) ...................................................................+38°C/W
(Note 1) .....................................................................+8°C/W
1400
1400
MIN
MIN
4.75
40
-3
2
CC
= +5V, T
TYP
TYP
5.00
206
CC
C
C
= -40°C to +85°C
through inductive
MAX
MAX
2200
2000
5.25
235
350
= +25°C, unless
0.8
+3
UNITS
UNITS
MHz
MHz
MHz
dBm
mA
V
V
V