MJD3055G ON Semiconductor, MJD3055G Datasheet
MJD3055G
Specifications of MJD3055G
MJD3055GOS
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MJD3055G Summary of contents
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MJD2955 (PNP) MJD3055 (NPN) Complementary Power Transistors DPAK For Surface Mount Applications Designed for general purpose amplifier and low speed switching applications. Features • Lead Formed for Surface Mount Applications in Plastic Sleeves (No Suffix) • Straight Lead Version in ...
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... MJD2955 MJD2955G MJD2955−001 MJD2955−001G MJD2955T4 MJD2955T4G MJD3055 MJD3055G MJD3055T4 MJD3055T4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MJD2955 (PNP) MJD3055 (NPN 25_C unless otherwise noted) ...
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... 0.13 (0.005) M 5.80 0.228 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS DPAK CASE 369C−01 ISSUE O SEATING −T− PLANE SOLDERING FOOTPRINT* 6.20 3.0 0.244 0.118 2 ...
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MJD2955 (PNP) MJD3055 (NPN −T− SEATING K PLANE 0.13 (0.005) M PACKAGE DIMENSIONS DPAK−3 CASE 369D−01 ISSUE B C NOTES ...