TGC4405-SM TriQuint, TGC4405-SM Datasheet - Page 15

• Manufacturer Part Number: TGC4405-SM
• Description: RF Mixer 17 - 27GHz Upconverter
• Manufacturer: TriQuint

Specifications of TGC4405-SM

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1061101

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Recommended Surface Mount Package Assembly
Time within 5 °C of Peak Temperature
• Proper ESD precautions must be followed while handling packages.
• Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry.
• TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow
• Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot
• Clean the assembly with alcohol.
Activation Time and Temperature
oven vendors’ recommendations when developing a solder reflow profile. Typical solder reflow profiles
are listed in the table below.
placement. The volume of solder paste depends on PCB and component layout and should be well
controlled to ensure consistent mechanical and electrical performance.
Time above Melting Point
Max Peak Temperature
Reflow Profile
Ramp-down Rate
Ramp-up Rate
TriQuint Semiconductor: www. triquint.com [phone] Fax [phone] [e-mail]
Typical Solder Reflow Profiles
TGC4405-SM
Ordering Information
Part
Assembly Notes
60 – 120 sec @ 140 – 160 °C
April 2007 © Rev -
60 – 150 sec
4 – 6 °C/sec
10 – 20 sec
3 °C/sec
QFN 4x4 Surface Mount
SnPb
240 °C
Package Style
60 – 180 sec @ 150 – 200 °C
TGC4405-SM
60 – 150 sec
4 – 6 °C/sec
10 – 20 sec
Pb Free
3 °C/sec
260 °C
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