MAX2023ETX-T Maxim Integrated Products, MAX2023ETX-T Datasheet - Page 12

• Manufacturer Part Number: MAX2023ETX-T
• Description: Modulator / Demodulator High-Dynamic-Range D irect Up-/Downconver
• Manufacturer: Maxim Integrated Products

Proper voltage-supply bypassing is essential for high-
frequency circuit stability. Bypass all VCC_ pins with
22pF and 0.1µF capacitors placed as close to the pins
as possible, with the smallest capacitor placed closest
to the device.
To achieve optimum performance, use good voltage-
supply layout techniques. The MAX2023 has several RF
processing stages that use the various VCC_ pins, and
while they have on-chip decoupling, off-chip interaction
between them may degrade gain, linearity, carrier sup-
pression, and output power-control range. Excessive
coupling between stages may degrade stability.
High-Dynamic-Range, Direct Up-/Downconversion
1500MHz to 2300MHz Quadrature Mod/Demod
12
_______________________________________________________________________________________________
Power-Supply Bypassing
RBIASLO3
RBIASLO2
RBIASLO1
VCCLOA
GND
GND
N.C.
GND
LO
1
5
6
2
3
4
7
8
9
10
36
11
35
12
34
BIAS
BIAS
BIAS
LO1
LO2
LO3
13
THIN QFN
33
90°
Pin Configuration/Functional Diagram
0°
14
32
The EP of the MAX2023’s 36-pin thin QFN-EP package
provides a low thermal-resistance path to the die. It is
important that the PC board on which the IC is mounted
be designed to conduct heat from this contact. In addi-
tion, the EP provides a low-inductance RF ground path
for the device.
The exposed paddle (EP) MUST be soldered to a
ground plane on the PC board either directly or through
an array of plated via holes. An array of 9 vias, in a 3 x
3 array, is suggested. Soldering the pad to ground is
critical for efficient heat transfer. Use a solid ground
plane wherever possible.
Exposed Paddle RF/Thermal Considerations
15
31
16
30
Σ
MAX2023
17
29
EP
18
28
26
22
27
25
24
23
21
20
19
GND
GND
GND
BBQ+
BBQ-
RF
BBI-
BBI+
GND