UPB1512TU-E2-A CEL, UPB1512TU-E2-A Datasheet - Page 10

no-image

UPB1512TU-E2-A

Manufacturer Part Number
UPB1512TU-E2-A
Description
Prescaler Silicon MMIC Presclr
Manufacturer
CEL
Datasheet

Specifications of UPB1512TU-E2-A

Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
NOTES ON CORRECT USE
RECOMMENDED SOLDERING CONDITIONS
methods and conditions other than those recommended below, contact your nearby sales office.
10
Infrared Reflow
Wave Soldering
Partial Heating
Caution Do not use different soldering methods together (except for partial heating).
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
(3) Keep the track length of the ground terminals as short as possible.
(4) Bypass capacitance must be attached to V
(5) Exposed heatsink at bottom on package must be soldered to PCB RF/DC ground.
This product should be soldered and mounted under the following recommended conditions.
Soldering Method
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (molten solder temperature)
Time at peak temperature
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (terminal temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
Data Sheet PU10537EJ02V0DS
CC
Soldering Conditions
line.
: 260°C or below
: 120±30 seconds
: 260°C or below
: 1 time
: 350°C or below
: 3 seconds or less
: 10 seconds or less
: 60 seconds or less
: 3 times
: 0.2%(Wt.) or below
: 10 seconds or less
: 0.2%(Wt.) or below
: 0.2%(Wt.) or below
Condition Symbol
µ
WS260
HS350
For soldering
IR260
PB1512TU

Related parts for UPB1512TU-E2-A