338970-1 TE Connectivity, 338970-1 Datasheet - Page 76

• Manufacturer Part Number: 338970-1
• Manufacturer: TE Connectivity

Specifications of 338970-1

• Lead Free Status / RoHS Status: Compliant

LAMFRAME
Key Features
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Low cost tape for memory
and microprocessor
applications
Compatible with industry
standard processes
Allow wide range of dielectric
(type and thickness)
Optimisation of dielectric
area for cost reduction
Minimum Slit Size:
0.15 mm
Products for Mobile Equipment
Mechatronic Center Niefern
LAMFRAME
This technology allows Tyco Electronics to
offer a wide range of products for memory
and microprocessor smart cards with:
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Lamination process is carried out in a clean room to avoid any outside contamination.
Tyco Electronics is able to perform bonding tests with gold or aluminium wires during design phase
but also to ensure the quality during all the life time of the products.
Products are today customer specific, Tyco Electronics Open Design available.
All specifications subject to change. Consult Tyco Electronics for latest specifications.
Plating Finishes
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Dielectric
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Customized thickness
Disconnection option
Gold
“Grey like” plating
Polyimide
Glass epoxy
Polyester
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Catalog 1654270-2
Revised 8-2007