1470636-1 TE Connectivity, 1470636-1 Datasheet - Page 75
1470636-1
Manufacturer Part Number
1470636-1
Description
Manufacturer
TE Connectivity
Datasheet
1.1470636-1.pdf
(116 pages)
Specifications of 1470636-1
Lead Free Status / RoHS Status
Not Compliant
- Current page: 75 of 116
- Download datasheet (8Mb)
Mechatronic Center
Niefern
Advanced Tyco Electronics
technologies allow us to
produce highly competitive
semi-finished products for
card manufacturers of the
1
■
■
■
■
The products are delivered
on a reel and can be used
for chip mounting by our
customers.
st
, 2
High-Speed Stamping
Selective Plating
Laminating
Reel-to-Reel Over-Molding
nd
and 3
rd
generation.
Products for Mobile Equipment
Mechatronic Center Niefern
Technology Portfolio
All specifications subject to change. Consult Tyco Electronics for latest specifications.
Reel-to-Reel
Over-Molding
■
■
Free cutting in line
Multiple cavities
mold
Reel-to-Reel Stamping
■
■
■
Reel-to-Reel Plating
■
■
■
Reel-to-Reel Lamination
■
■
■
■
■
Bonding Capability Guaranty
High-speed stamping
4 fold stamping tool,
70 mm width
Material: Copper alloy
Plating in 70 mm width
Selective Metalization:
●
●
●
Slitting in 35 mm
Clean room class 100,000
High accuracy dielectric
stamping
Mechanical alignment and
prefixing of dielectric
Leadframe roll lamination
100 % video control
Overall Ni
Contacts Side:
– Spots on contact area
– Gold flash
Bonding Side:
– Strips or Spots
Catalog 1654270-2
Revised 8-2007
73
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