Thermal Characteristics
Electrical Characteristics
Maximum Ratings
Features
•
•
•
•
•
•
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current
Power Dissipation (Note 3) @ T
Thermal Resistance, Junction to Ambient (Note 3)
Operating and Storage Temperature Range
OFF CHARACTERISTICS (Note 4)
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage
Emitter-Base Breakdown Voltage
Collector Cut-off Current
Emitter Cut-off Current
ON CHARACTERISTICS (Note 4)
Collector-Emitter Saturation Voltage
Base-Emitter Saturation Voltage
Static Forward Current Transfer Ratio
SMALL SIGNAL CHARACTERISTICS
Transition Frequency
Output Capacitance
Notes:
DXTA42
Document number: DS31158 Rev. 4 - 2
Epitaxial Planar Die Construction
Complementary PNP Type Available (DXTA92)
Ideally Suited for Automated Assembly Processes
Ideal for Medium Power Switching or Amplification Applications
Lead Free By Design/RoHS Compliant (Note 1)
"Green" Device (Note 2)
1.
2.
3.
4.
No purposefully added lead.
Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
Device mounted on FR-4 PCB; pad layout as shown on page 4 or in Diodes Inc. suggested pad layout document AP02001, which can
Measured under pulsed conditions. Pulse width = 300μs. Duty cycle ≤ 2%.
be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
Characteristic
Characteristic
Characteristic
@T
Top View
A
A
= 25°C
= 25°C unless otherwise specified
@T
A
= 25°C unless otherwise specified
V
V
V
Symbol
V
V
(BR)CBO
(BR)CEO
(BR)EBO
CE(SAT)
BE(SAT)
I
C
I
Device Schematic
h
www.diodes.com
CBO
EBO
f
obo
FE
T
1 of 4
Min
300
300
⎯
⎯
⎯
⎯
25
40
40
50
⎯
Mechanical Data
•
•
•
•
•
•
•
Symbol
6
V
V
V
T
Symbol
CBO
CEO
EBO
I
Please click here to visit our online spice models database.
C
J
R
Case: SOT89-3L
Case Material: Molded Plastic, "Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Finish — Matte Tin annealed over Copper leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
Marking & Type Code Information: See Page 3
Ordering Information: See Page 3
Weight: 54.8mg (approximate)
, T
P
θ JA
D
STG
Typ
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
NPN SURFACE MOUNT TRANSISTOR
Max
0.1
0.1
0.5
0.9
⎯
⎯
⎯
⎯
⎯
3
-55 to +150
Value
Value
Pin Out Configuration
300
300
500
125
1
Unit
MHz
6
1
μA
μA
pF
⎯
V
V
V
V
V
2,4
3
I
I
I
V
V
I
I
I
I
I
I
f = 100MHz
V
C
C
E
C
C
C
C
C
C
CB
EB
CB
= 100μA, I
= 1mA, I
= 100μA, I
= 20mA, I
= 20mA, I
= 1mA, V
= 10mA, V
= 30mA, V
= 10mA, V
= 6V, I
= 200V, I
= 20V, f = 1MHz
Test Conditions
B
C
CE
B
B
= 0
C
E
= 0
CE
CE
CE
E
= 2mA
= 2mA
= 0
= 0
= 10V
= 0
= 10V
= 10V
= 20V,
© Diodes Incorporated
°C/W
December 2009
DXTA42
Unit
Unit
mA
°C
W
V
V
V