MPZ2012S101AT TDK Corporation, MPZ2012S101AT Datasheet
MPZ2012S101AT
Manufacturer Part Number
MPZ2012S101AT
Description
Manufacturer
TDK Corporation
Type
Chip Beadr
Datasheet
1.MPZ2012S101AT.pdf
(2 pages)
Specifications of MPZ2012S101AT
Inductance
Not RequireduH
Technology
Multi-Layer
Impedance
100Ohm
Tolerance (+ Or -)
25%
Dc Resistance
20mOhm
Case Size (inches)
0805in
Operating Temp Range
-55C to 125C
Test Frequency
100MHz
Dc Current
4A
Product Diameter (mm)
Not Requiredmm
Product Height (mm)
0.85mm
Product Depth (mm)
1.25mm
Product Length (mm)
2mm
Military Standard
Not Required
Failure Rate
Not Required
Lead Free Status / RoHS Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPZ2012S101AT
Manufacturer:
TDK
Quantity:
1 939
Part Number:
MPZ2012S101AT
Manufacturer:
TDK/东电化
Quantity:
20 000
Part Number:
MPZ2012S101AT000
Manufacturer:
TDK/东电化
Quantity:
20 000
Part Number:
MPZ2012S101ATD25
Manufacturer:
TDK/东电化
Quantity:
20 000
Chip Beads(SMD)
For Power Line
MPZ Series MPZ2012 Type
FEATURES
• The MPZ series are multilayer chip impeders for power supply
• High miniaturized, these parts nonetheless exhibit low DC
• The products contain no lead and also support lead-free
• It is a product conforming to RoHS directive.
APPLICATIONS
Removal of power line noises of cellular phones, PCs, note PCs,
TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game
machines, digital photo frames, car navigation system, PNDs, etc.
PRODUCT IDENTIFICATION
(1)Series name
(2)Dimensions L× W
(3)Material code
(4)Nominal impedance
(5)Characteristic type
(6)Packaging style
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
• After mounting components onto the printed circuit board, do not
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
• Please contact our Sales office when your application are considered the following:
• All specifications are subject to change without notice.
MPZ 2012 S 331 A T
(1)
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
line applications.
resistance and high current handling capability.
soldering.
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
apply stress through board bending or mishandling.
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
331: 330Ω at 100MHz
T: Taping
(2) (3) (4) (5) (6)
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
TEMPERATURE RANGES
Operating/storage
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
250 to 260˚C
230˚C
180˚C
150˚C
2.0 ±0.2
0.5±0.3
Preheating
60 to 120s
Time(s)
0.8
–55 to +125°C
Quantity
4000 pieces/reel
Soldering
10s max.
30 to 60s
1
0.8
007-01 / 20090910 / e9413_mpz.fm
Conformity to RoHS Directive
Natural
cooling
Weight: 8mg
Dimensions in mm
(1/2)
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MPZ2012S101AT Summary of contents
Page 1
Chip Beads(SMD) For Power Line MPZ Series MPZ2012 Type FEATURES • The MPZ series are multilayer chip impeders for power supply line applications. • High miniaturized, these parts nonetheless exhibit low DC resistance and high current handling capability. • The ...
Page 2
ELECTRICAL CHARACTERISTICS Impedance DC resistance Part No. ∗1 (Ω)[100MHz] (Ω)max. MPZ2012S300A 30±10Ω 0.01 MPZ2012S101A 100±25% 0.02 MPZ2012S221A 220±25% 0.04 MPZ2012S331A 330±25% 0.05 MPZ2012S601A 600±25% 0.1 MPZ2012S102A 1000±25% 0.15 ∗1 : Test equipment E4991A or equivalent : Test tool 16192A or ...