MF-MSMD160-2 Bourns Inc., MF-MSMD160-2 Datasheet - Page 2
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MF-MSMD160-2
Manufacturer Part Number
MF-MSMD160-2
Description
PTC Resettable Fuses 8Volts Hold=1.6Amps 2.8Amps Trip
Manufacturer
Bourns Inc.
Type
PTC Resettable Fusesr
Series
MF-MSMDr
Datasheet
1.MF-MSMDLAB.pdf
(4 pages)
Specifications of MF-MSMD160-2
Hold Current
1.6 Amps
Trip Current
2.8 Amps
Current Rating (max)
100 Amps
Resistance
0.099 Ohms
Maximum Voltage
8 VoltsDC
Termination Style
SMD/SMT
Mounting Style
SMD/SMT
Current Rating
100 Amps
Dimensions
4.73 mm L x 3.41 mm W x 0.48 mm H
Operating Temperature Range
- 40 C to + 85 C
Package / Case
1812 (4532 metric)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MF-MSMD160-2
Manufacturer:
BOURNS
Quantity:
26 150
Company:
Part Number:
MF-MSMD160-2-6
Manufacturer:
BOURNS
Quantity:
500
Terminal material: solder-plated copper
Termination pad solderability: Meets EIA
Specification RS-186-9E, ANSI/J-STD-002
Category 3.
Recommended Pad Layout
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Additional Features
Packaging: 2000 pcs. per reel.
Product Dimensions
MF-MSMD010
MF-MSMD014
MF-MSMD020
MF-MSMD030
MF-MSMD050
MF-MSMD075
MF-MSMD110
MF-MSMD125
MF-MSMD150
MF-MSMD160
MF-MSMD200
MF-MSMD260
(.059 ± .002)
Patents pending
1.5 ± 0.05
Top and Bottom View
Model
MF-MSMD Series -
(.106 ± .004)
2.70 ± 0.1
D
A
B
C
Side View
(0.126 ± .004)
(0.172)
(0.172)
(0.172)
(0.172)
(0.172)
(0.172)
(0.172)
(0.172)
(0.172)
(0.172)
(0.172)
(0.172)
3.2 ± 0.1
(.059 ± .002)
Min.
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
4.37
1.5 ± 0.05
A
PTC Resettable Fuses
(0.186)
(0.186)
(0.186)
(0.186)
(0.186)
(0.186)
(0.186)
(0.186)
(0.186)
(0.186)
(0.186)
(0.186)
Max.
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
4.73
Note:
• MF-MSMD models can be wave soldered and reworked.
• If reflow temperatures exceed the recommended profile, devices may not meet the performance
Applications
High Density Circuit Board Applications:
Solder Reflow Recommendations
requirements.
Hard disk drives
PC motherboards
PC peripherals
Point-of-sale (POS) equipment
PCMCIA cards
300
250
200
150
100
50
0
(0.121)
(0.121)
(0.121)
(0.121)
(0.121)
(0.121)
(0.121)
(0.121)
(0.121)
(0.121)
(0.121)
(0.121)
Min.
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
3.07
B
Preheating
160–220
(0.134)
(0.134)
(0.134)
(0.134)
(0.134)
(0.134)
(0.134)
(0.134)
(0.134)
(0.134)
(0.134)
(0.134)
Max.
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
3.41
Time (seconds)
Soldering
(0.022)
(0.022)
(0.022)
(0.022)
(0.015)
(0.015)
(0.015)
(0.012)
(0.012)
(0.012)
(0.012)
(0.010)
Min.
0.56
0.56
0.56
0.56
0.38
0.38
0.38
0.30
0.30
0.30
0.30
0.25
10–20
C
(0.032)
(0.032)
(0.032)
(0.032)
(0.024)
(0.024)
(0.024)
(0.019)
(0.019)
(0.019)
(0.019)
(0.019)
Cooling
Max.
0.81
0.81
0.81
0.81
0.62
0.62
0.62
0.48
0.48
0.48
0.48
0.48
120
UNIT =
(0.012)
(0.012)
(0.012)
(0.012)
(0.012)
(0.012)
(0.012)
(0.012)
(0.012)
(0.012)
(0.012)
(0.012)
Min.
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
0.30
D
(INCHES)
MM