532823-2 TE Connectivity, 532823-2 Datasheet
532823-2
Manufacturer Part Number
532823-2
Description
High Speed / Modular Connectors RA SOCKET CONTACT 250
Manufacturer
TE Connectivity
Type
Coaxial Terminalr
Series
AMP-HDI Seriesr
Datasheet
1.532823-2.pdf
(1 pages)
Specifications of 532823-2
Body Plating
Gold Over Nickel
Gender
F
Product Type
Contacts
Mounting Angle
Right
Termination Style
Solder
Contact Plating
Gold over Nickel
Pcb Mounting Orientation
Right Angle
Pcb Mount Retention
Without
Solder Tail Contact Plating
Tin-Lead
Contact Type
Socket
Contact Plating, Mating Area, Material
Gold (30)
Rohs/elv Compliance
Not ELV/RoHS compliant
Lead Free Solder Processes
Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C, Reflow solder capable to 245°C, Reflow solder capable to 260°C, Pin-in-Paste capable to 245°C, Pin-in-Paste capable to 260°C
Application
Board-to-Board Power
Lead Free Status / RoHS Status
Not Compliant
532823 - 2 Product Details
Products
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Documentation & Additional Information
Product Drawings:
Catalog Pages/Data Sheets:
Product Specifications:
Application Specifications:
Instruction Sheets:
CAD Files:
Product Features
Product Type Features:
Termination Related Features:
Contact Related Features:
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532823
receptacle assembly power contact hdi
None Available
Connector, Interconnect, High Density
AMP- HDI Connectors
Extraction Tool for AMP
English)
None Available
Product Type = Contact
Pin/Socket
PCB Mount Angle
PCB Retention Feature
Solder Tail Contact Plating = Tin
Contact Mating Area Plating Material = Gold
(30) over Nickel (50)
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Documentation
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By Type
- 2
= Socket
(Please use the Product Drawing for all design activity)
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Two - Piece Connector
= Right Angle
Home
AMP - HDI Hybrid Connectors and Contacts
Resources
Not EU RoHS or ELV Compliant
Alternates
(PDF, English)
Product Highlights:
Products
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= No
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- HDI Hybrid Connector Power a...
Contact
Socket
PCB Mount Angle = Right Angle
Board - to - Board Power Application
No PCB Retention Feature
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RoHS/ELV Compliance
compliant
Lead Free Solder Processes
capable to 240°C, Wave solder capable to 260°
C, Wave solder capable to 265°C, Reflow
solder capable to 245°C, Reflow solder capable
to 260°C, Pin - in - Paste capable to 245°C, Pin
in - Paste capable to 260°C
Application = Board
Brand = AMP
(PDF,
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- to - Board Power
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